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A method for improving welding performance of 5g communication module

A communication module and welding performance technology, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve problems such as false welding, achieve bright and full solder joints, increase inner temperature, and good moisture

Active Publication Date: 2022-07-05
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for improving the welding performance of 5G communication modules in order to solve the above problems, mainly by adding modified materials to the solder paste part, and then mixing the solder paste and tin powder to make solder paste. It can release heat and increase the temperature inside the shielding cover in the module, which can effectively improve the poor soldering performance caused by the temperature inside the shielding cover, especially the problem of false soldering of the module, and can obtain a welding effect with good moisture and bright and full solder joints

Method used

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  • A method for improving welding performance of 5g communication module

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Comparison scheme
Effect test

Embodiment 1

[0021] A material is added in the preparation process of the solder paste, and the obtained solder paste is uniformly mixed with the tin powder to prepare the solder paste;

[0022] The operation steps of the method for improving the welding performance of a 5G communication module are as follows:

[0023] Step 1: heating and stirring the quantitative components of rosin, solvent, thixotropic agent and modification additive to obtain a mixture;

[0024] Step 2: Add the active agent of quantitative components to the mixture, heat and stir evenly, and then cool to room temperature to become a flux paste;

[0025] Step 3: Put the flux paste and tin powder into the solder paste mixer, heat and stir evenly to get the solder paste.

[0026] As a technical optimization scheme of the present invention, it is composed of the following raw materials by weight: 11% of solder paste, 89% of tin powder, wherein the mass percentage of the solder paste contains 35%-40% rosin, 40%-45% % of s...

Embodiment 2

[0033] Based on the method for improving the welding performance of a 5G communication module provided by the first embodiment of the present invention, the method for improving the welding performance of a 5G communication module provided by the second embodiment of the present invention is different in that the solder paste includes the following raw materials by mass percentage: Soldering paste 11% (wherein the soldering paste includes the following mass percentage materials, 40% rosin, 43% diethylene glycol dibutyl ether and ethylene glycol butyl methyl ether, 4% hydrogenated castor oil, 9% hexane Diacid and stearic acid, 2% benzotriazole, 1% OP-10 and 1% terminal azide polyazide glycidyl ether), tin powder 89%, rosin in the solder paste It accounts for 40% of the solder paste, which can effectively improve the poor soldering performance caused by the temperature in the shield, especially the false soldering problem of the module.

Embodiment 3

[0035] Based on the method for improving the welding performance of a 5G communication module provided by the first embodiment of the present invention, the method for improving the welding performance of a 5G communication module provided by the third embodiment of the present invention is different in that: the solder paste includes the following raw materials by mass percentage: Soldering paste 11% (wherein the soldering paste includes the following mass percentage materials, 41% rosin, 43% diethylene glycol dibutyl ether and ethylene glycol butyl methyl ether, 4% hydrogenated castor oil, 9% hexane Diacid and stearic acid, 2% of benzotriazole, 1% of OP-10), 89% of tin powder, using the above scheme to prepare the modified material in the solder paste can release heat during the welding process, improve the module Temperature inside the middle shield.

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Abstract

The invention discloses a method for improving the welding performance of a 5G communication module, which comprises the following raw materials by weight: 11% of solder paste and 89% of tin powder, wherein the mass percentage of the solder paste contains 35%-40% of Rosin, 40%-45% solvent, 2%-3% thixotropic agent, 5%-10% active agent, 1-2% corrosion inhibitor, 0.5%-1% surfactant and 1- 2% polyazide glycidyl ether modified substance, when preparing the method to improve the welding performance of 5G communication module, the modified material is mainly added to the solder paste part, and then the solder paste is mixed with the solder paste and tin powder to make the solder paste. The quantitative components of rosin, solvent, thixotropic agent and modified additive are heated and stirred evenly, so that the mixture can release heat during the welding process and increase the temperature inside the shielding cover of the module, which can effectively improve the welding caused by the temperature inside the shielding cover. Poor performance, especially the false soldering problem of the module, can obtain the welding effect of good wetting and bright and full solder joints.

Description

technical field [0001] The invention relates to a method for welding performance, in particular to a method for improving the welding performance of a 5G communication module, and belongs to the field of conformal paint for 5G communication modules. Background technique [0002] 5G mobile networks Like earlier 2G, 3G and 4G mobile networks, 5G networks are digital cellular networks in which the service area covered by a provider is divided into many small geographic areas called cells. Analog signals representing sound and images are digitized in mobile phones, converted by analog-to-digital converters and transmitted as a bit stream. All 5G wireless devices in the cell communicate via radio waves with the local antenna array and low-power automatic transceivers (transmitters and receivers) in the cell. [0003] However, at present, most of the current attention is on the solderability of solder paste, but an important issue is ignored, which is the problem of temperature d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/00B23K35/36B23K35/363
CPCB23K1/00B23K35/3612B23K35/362
Inventor 吴晶李静郭万强张瑜刘伟俊廖高兵
Owner 深圳市唯特偶新材料股份有限公司
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