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Sidelobe cutting method and device

A technology of cutting side lobes and side lobes, which is applied in the field of array digital beamforming radiation source reception, can solve the problems of large system scale, incomplete suppression of side lobes, and high cost, and achieve the effect of saving system costs

Pending Publication Date: 2020-07-03
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high sensitivity and wide airspace coverage are also more susceptible to the impact of incident signals in non-coverage areas. Therefore, the DBF receiving array must be configured with multiple directional side-lobe antennas to achieve sidelobe suppression in non-coverage areas.
[0003] like figure 1 As shown, in the existing design, multiple DBF receiving arrays use independent sidelobe-cut antenna groups to achieve their own sidelobe suppression. The antennas, receiving channels, and array processing resources are integral multiples of a single array, and the system scale is large and the cost is high. , and when the distances between the arrays are relatively close, there may be situations where the arrays block each other and cause the beam pattern of the sidelobe antenna to change, resulting in the fact that the sidelobe cannot be completely suppressed

Method used

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  • Sidelobe cutting method and device

Examples

Experimental program
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Effect test

Embodiment 1

[0033] In order to solve the problem of reducing the scale of the antenna, the sidelobe suppression of the main beam non-coverage direction signal can also be completed without separately setting the sidelobe cut channel. In this embodiment, a sidelobe cutting method and a corresponding device are specifically provided, including a DBF receiving array and an acquisition module 3, the number of the DBF receiving arrays is greater than or equal to 2, and each DBF receiving array includes a A channel of the main beam, wherein a part of the channel is extracted as a channel 4 for sidelobe cut beam formation.

[0034] Take the four-sided DBF receiving array as an example, such as figure 1 Shown is a schematic diagram of the composition of four-sided DBF receiving array antennas in the prior art. The present invention is further made on the basis of canceling the special cut-side lobe antennas for each array. By extracting a certain number of array element data of each DBF receiving...

Embodiment 2

[0060] In order to save hardware processing resources, on the basis of Embodiment 1, the collected first side lobes are compared, and only the first side lobes with the largest amplitude of each angle beam are reserved, and the largest first side lobes are retained. The set of lobe beams serves as the second sidelobe cut beam.

[0061] The second sidelobe cut beam can be expressed by the following formula:

[0062]

Embodiment 3

[0064] In order to reduce the receiving channel, to further reduce the scale and cost of the system equipment, on the basis of embodiment 1 or 2, the same collection data is selected and / or combined to output, and each DBF receiving array is divided into two The sub-arrays work, and each sub-array includes the main channel and the side lobe channel, such as figure 2 As shown, taking the four-sided DBF receiving array as an example, each DBF receiving array includes two sub-arrays, the left sub-array and the right sub-array. When the sub-arrays of the DBF receiving array work independently or coherently, the data selection module 5 is required. Assuming that the single-array size of the DBF receiving array is 16 elements, the left and right sub-arrays each work independently with 8 elements, and each of the left and right sub-arrays extracts 4 elements of data as the sub-array side-lobe cut channel 1 and the sub-array non-cut side-lobe channel 2, each array From left to right,...

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Abstract

The invention discloses a sidelobe cutting method and a device using the sidelobe cutting method and relates to the field of array digital beam forming radiation source receiving. The device comprisesDBF receiving arrays with two or more surfaces, wherein each DBF receiving array comprises a channel for forming a main beam, part of the channels are extracted to form sidelobe cutting beams while the main beam is formed, channel data of each array are collected to form a main beam of each array, a certain number of channel data of each array are extracted to form a first tangent sidelobe beam of each array, each first tangent sidelobe wave beam is processed to obtain a second tangent sidelobe wave beam, the second tangent sidelobe wave beam is used for carrying out sidelobe suppression of asignal in a main wave beam sidelobe incoming wave direction, each main wave beam is processed by using the second sidelobe cutting wave beam to finish signal receiving in the main wave beam coveragedirection, as the channel data for sidelobe cutting shares the channel data for the main beam, each DBF receiving array is not independently provided with a sidelobe cutting channel, and the scale andcost of the system equipment are greatly reduced.

Description

technical field [0001] The invention relates to the field of array digital beamforming radiation source reception, in particular to a sidelobe cutting method and device. Background technique [0002] In the field of radiation source reception, array DBF technology has been widely used due to its high sensitivity and wide airspace coverage. However, high sensitivity and wide airspace coverage are also more susceptible to the impact of incident signals in non-coverage areas. Therefore, the DBF receiving array must be configured with multiple directional side-lobe antennas to achieve sidelobe suppression in non-coverage areas. [0003] Such as figure 1 As shown, in the existing design, multiple DBF receiving arrays use independent sidelobe-cut antenna groups to achieve their own sidelobe suppression. The antennas, receiving channels, and array processing resources are integral multiples of a single array, and the system scale is large and the cost is high. , and when the dist...

Claims

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Application Information

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IPC IPC(8): G01S13/00G01S7/35G01S7/285H01Q21/00
CPCG01S7/285G01S7/352G01S13/00H01Q21/00
Inventor 吴永伦哈章王兵卢俊华李盾王建龙小专
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP