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Method for fixing sheet-shaped or plate-shaped electronic component on substrate in sealing manner

A technology for electronic components and components, which is applied in the field of packaging of electrode sheets during preparation, can solve the problems of difficult operation, inability to ensure solderability and sealing performance at the same time, and inability to remove air in time.

Active Publication Date: 2020-07-03
JIANGSU HEALTHY LIFE INNOVATION MEDICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this fixation is not firm
[0004] When the components need to be welded and sealed at the same time, the solder shrinks inward during the welding process, and the glue is expansive. It is difficult to perform welding and sealing at the same time, and it is impossible to guarantee both weldability and sealing.
There is also a plan to fill the glue between the component and the substrate after welding in advance. The purpose is to increase the welding firmness between the component and the substrate, because there is a gap between the substrate and the component after welding, and the glue is filled in the gap The air in the time gap cannot be removed in time, resulting in voids in the filler, which cannot form a seal between the component and the substrate
For the method of wrapping the package around the component and the substrate, the thickness and diameter of the edge of the component are increased, which is not suitable for small-volume fine components

Method used

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  • Method for fixing sheet-shaped or plate-shaped electronic component on substrate in sealing manner
  • Method for fixing sheet-shaped or plate-shaped electronic component on substrate in sealing manner
  • Method for fixing sheet-shaped or plate-shaped electronic component on substrate in sealing manner

Examples

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Embodiment 1

[0040] The first embodiment of the present invention provides a method for hermetically fixing chip or plate-shaped electronic components on a substrate. Chip or plate electronic components see figure 1As shown, the electronic component 2 can be flexible or rigid, and its thickness can be as thin as micron or thicker. The sheet or board electronic components can be in regular shapes such as circles, squares, rhombuses, ellipses, trapezoids, etc., or in irregular shapes. In this embodiment, a circular electronic component with a certain thickness is taken as an example for illustration. This circular electronic component is generally applied to electrode pads. The method that this embodiment provides comprises the steps:

[0041] S1, open at least one vent hole 4 on the sheet or plate-shaped electronic component 2 (such as figure 1 , 2 shown);

[0042] S2, the sheet or plate-shaped electronic components 2 are preliminarily fixed on the surface of the substrate 1 through p...

Embodiment 2

[0053] Example 2 shows a method for preparing an electrode sheet, the key of which is to use the fixing and sealing method of Example 1, so that the base 1 and the component 2 are firmly and hermetically fixed together, and there is a conductor between the base 1 and the component 2 3 (solder spot of the above embodiment), and there is basically no air remaining in the middle (as shown in Figure 7), thereby avoiding the problem of deformation of the electrode sheet due to the increase of the ambient temperature during use, and increasing the service life of the electrode sheet.

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Abstract

The invention provides a method for fixing a sheet-shaped or plate-shaped electronic component on a substrate in a sealed mode. The method comprises: S1, forming at least one exhaust hole in the sheet-shaped or plate-shaped electronic component; S2, preliminarily fixing the sheet-shaped or plate-shaped electronic component on the surface of the substrate through point connection, so that a gap isformed between the substrate and the component; S3, filling the gap with a first filler with fluidity along the edge of the sheet-shaped or plate-shaped electronic component; S4, curing the first filler to enable the edge of the sheet-shaped or plate-shaped electronic component and the substrate to be completely sealed; and S5, filling the exhaust hole with a second filler at room temperature, andcuring the second filler.

Description

technical field [0001] The invention relates to a method for packaging electronic components, in particular to a method for packaging electrode sheets during preparation. Background technique [0002] Until now, electronic component sealing technology has generally adopted two methods. One is to apply glue between the components and the substrate (also known as the substrate, base sheet or base); the other is to wrap the sealant around the components and the substrate to achieve the purpose of sealing. [0003] When fixing fine sheet or plate-shaped components to the substrate, the components are generally welded on the substrate, that is, the solder is first applied on the surface of the substrate, and then the components and the substrate are soldered and fixed by heating. But this fixation is not firm. [0004] When the components need to be welded and sealed at the same time, the solder shrinks inward during the welding process, and the glue is expansive. It is difficu...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L21/56H01L23/31H01L23/488
CPCH01L21/50H01L21/56H01L23/488H01L23/3157H01L2224/73204
Inventor 陈亮孙义冬周波于晶黄勇
Owner JIANGSU HEALTHY LIFE INNOVATION MEDICAL TECH CO LTD