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microwave heating equipment

A microwave heating equipment and hot-end technology, applied in microwave heating, electric/magnetic/electromagnetic heating, electric heating devices, etc., can solve problems such as insufficient heat dissipation capacity, high noise of solid-state sources, etc., achieve good mute effect, convenient structural design, and use long life effect

Active Publication Date: 2022-08-02
GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a microwave heating device to solve the problems of high noise and insufficient heat dissipation capacity when the solid-state source dissipates heat

Method used

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Embodiment approach

[0034] According to another embodiment of the present invention, the base plate portion includes a second surface serving as the hot end, the microwave heating device includes a heat dissipation portion 3, and the heat dissipation portion 3 includes a main body attached to the second surface The plate 31 and the plurality of heat dissipation teeth 4 connected to the main body plate 31 and arranged at intervals. The heat dissipation part 3 can be made of a material with good thermal conductivity, such as metal, alloy and the like. The heat dissipation part 3 includes a main body plate 31 and heat dissipation teeth 4. The main body plate 31 is engaged with the second surface of the refrigeration semiconductor 2 so as to receive heat from the hot end of the refrigeration semiconductor 2. The heat dissipation teeth 4 are arranged on the main body plate 31 at intervals, which can increase the The overall heat dissipation area of ​​the heat dissipation part 3 is used to dissipate th...

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Abstract

The invention relates to the field of household appliances, and discloses a microwave heating device, wherein the microwave heating device comprises a solid-state source (1) capable of emitting microwaves and a refrigeration semiconductor (2), the refrigeration semiconductor (2) includes The cold end thermally coupled to the heating part of the solid state source (1) and the hot end remote from the solid state source (1), the refrigeration semiconductor (2) can conduct heat from the cold end to the hot end. Through the above technical solution, the refrigeration semiconductor can continuously dissipate heat to the solid source, and the refrigeration semiconductor is not provided with movable parts, no noise, no vibration effect, good mute effect, not easy to damage, long service life, and relatively small size. Smaller, more convenient for the structural design of the product.

Description

technical field [0001] The present invention relates to household appliances, in particular to a microwave heating device. Background technique [0002] At present, microwave ovens generally use magnetrons to generate microwaves to achieve heating, and magnetrons have the disadvantages of large size and high rated voltage. Some new microwave ovens use the microwave source as a solid-state source. During the operation of the solid-state source, the main circuit board, especially the position of the chip, will generate a lot of heat. If the heat cannot be dissipated in time, it will affect the efficiency and life of the chip, resulting in a decrease in output power. and so on. [0003] In the prior art, aluminum alloy profiles are used to make a heat dissipation part including a base plate and a tooth-like structure, so that the base plate and the solid-state source are joined to receive heat. The tooth-like structure can increase the contact area between the metal and the ai...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05B6/64
CPCH05B6/642
Inventor 陈宗龙
Owner GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD