PCB and preparation method thereof

Abstract

The invention provides a PCB and a preparation method thereof. The periphery of the PCB is processed into process edges with copper foil layers. The PCB process edge provided by the invention is provided with the copper foil layer, on one hand, the copper foil layer can play a role in physical fixation, and due to the fact that the copper foils are arranged on the periphery of the PCB, glue flowing can be uniform; and on the other hand, the copper foil also has certain stress shrinkage, so that the design of the reserved copper foil layer can play a role in balancing gummosis stress pulling inthe plate pressing process, and the problems of large size expansion and shrinkage, poor subsequent processing alignment, poor punching matching, poor accurate feeding and the like of the PCB after plate pressing are solved.

Description

technical field [0001] The invention belongs to the field of PCB board preparation, and relates to a PCB board and a preparation method thereof. Background technique [0002] PCB multi-layer board lamination, due to the influence of pressure plate flow glue and material heat, there will be problems of size expansion and contraction, resulting in inaccurate alignment of PCB images, holes, etc., unable to drive rivets, uneven matching, etc., affecting subsequent PCB alignment And processing parts, etc. At present, the board edge image design of PCB core board is mainly copper PAD distribution or copper-free design. This design cannot improve the problem of large board size expansion and contraction after PCB pressing, especially for boards with high glue content and large glue flow. , the size expansion and contraction is larger, for some PCB processing with size expansion and contraction, and high alignment requirements, it is easy to have problems such as inaccurate alignme...

AI Technical Summary

Problems solved by technology

This invention solves a series of problems caused by sinking copper milling boards due to the expansion and contraction of the PCB board, but this invention does not fundamentally solve the problem of PCB expansion and contraction

CN106572600A discloses a new type of PCB linear expansion and contraction control method, including the following steps: engineering design, making engineering data according to the requirements of the customer's drawings, and the engineering data is based on the customer's data, using the established expansion and contraction database, and finding out through the principle of information comparison Get the expansion and contraction value of the historical PCB board that meets the information comparison principle, apply the expansion and contraction value to the PCB board design that is currently processed to make engineering data; make the PCB board, make the PCB board according to the engineering data that the engineering design has made, And in the production process, the station data information and shrinkage value of the currently processed PCB board are collected, and the station data information, shrinkage value, design information and material information of the currently processed PCB board are stored in the shrinkage database. It will be used as a reference for the comparison of PCB board designs in the future; testing, testing the finished PCB boards, judging whether the finished PCB boards are qualified, and mass production if they are qualified; this invention can prevent and control the expansion and shrinkage of PCB core boards in advance, but The expansion and contraction database used in it needs to be built in advance, and it takes a lot of time and effort to establish the expansion and contraction database

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