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PCB and preparation method thereof

A kind of PCB board, process edge technology, applied in the field of PCB board and its preparation, can solve the problem of spending a lot of time and energy

Pending Publication Date: 2020-07-07
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention solves a series of problems caused by sinking copper milling boards due to the expansion and contraction of the PCB board, but this invention does not fundamentally solve the problem of PCB expansion and contraction
CN106572600A discloses a new type of PCB linear expansion and contraction control method, including the following steps: engineering design, making engineering data according to the requirements of the customer's drawings, and the engineering data is based on the customer's data, using the established expansion and contraction database, and finding out through the principle of information comparison Get the expansion and contraction value of the historical PCB board that meets the information comparison principle, apply the expansion and contraction value to the PCB board design that is currently processed to make engineering data; make the PCB board, make the PCB board according to the engineering data that the engineering design has made, And in the production process, the station data information and shrinkage value of the currently processed PCB board are collected, and the station data information, shrinkage value, design information and material information of the currently processed PCB board are stored in the shrinkage database. It will be used as a reference for the comparison of PCB board designs in the future; testing, testing the finished PCB boards, judging whether the finished PCB boards are qualified, and mass production if they are qualified; this invention can prevent and control the expansion and shrinkage of PCB core boards in advance, but The expansion and contraction database used in it needs to be built in advance, and it takes a lot of time and effort to establish the expansion and contraction database

Method used

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  • PCB and preparation method thereof
  • PCB and preparation method thereof
  • PCB and preparation method thereof

Examples

Experimental program
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Embodiment 1

[0030] like figure 1 As shown, this embodiment provides a PCB board, which is composed of a PCB graphic area 101 and a process edge 102 .

[0031] Among them, the width of the process side is 10mm, and it is composed of four processing parts connected to each other from the end to the end. The processing part has a copper foil layer, and two air guide grooves with a width of 5cm are arranged on the copper foil layer.

[0032] The preparation method is as follows: the copper clad laminate is sequentially cut, drilled, copper plated, exposed and developed, etched and washed, browned, laminated, pressed, and the outer layer PCB pattern is made to obtain the PCB board.

[0033] Wherein, the film pattern used in the exposure and development process has a process edge structure.

Embodiment 2

[0035] like figure 1 As shown, this embodiment provides a PCB board, which is composed of a PCB graphic area 101 and a process edge 102 .

[0036] Among them, the width of the process side is 50 mm, and it is composed of four processing parts connected end to end. The processing part has a copper foil layer, and five air guide grooves with a width of 2 cm are arranged on the copper foil layer of the processing part.

[0037] The preparation method is as follows: the copper clad laminate is sequentially cut, drilled, copper plated, exposed and developed, etched and washed, browned, laminated, pressed, and the outer layer PCB pattern is made to obtain the PCB board.

[0038] Wherein, the film pattern used in the exposure and development process has a process edge structure.

[0039] During the preparation process of the PCB board prepared above, the film pattern has a process edge structure, so the copper foil layer in the process edge is retained during the etching and washing...

Embodiment 3-5

[0041] The only difference from Embodiment 1 is that in this embodiment, the width of the process side is 20mm (Example 3), 25mm (Example 4), and 40mm (Example 5).

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Abstract

The invention provides a PCB and a preparation method thereof. The periphery of the PCB is processed into process edges with copper foil layers. The PCB process edge provided by the invention is provided with the copper foil layer, on one hand, the copper foil layer can play a role in physical fixation, and due to the fact that the copper foils are arranged on the periphery of the PCB, glue flowing can be uniform; and on the other hand, the copper foil also has certain stress shrinkage, so that the design of the reserved copper foil layer can play a role in balancing gummosis stress pulling inthe plate pressing process, and the problems of large size expansion and shrinkage, poor subsequent processing alignment, poor punching matching, poor accurate feeding and the like of the PCB after plate pressing are solved.

Description

technical field [0001] The invention belongs to the field of PCB board preparation, and relates to a PCB board and a preparation method thereof. Background technique [0002] PCB multi-layer board lamination, due to the influence of pressure plate flow glue and material heat, there will be problems of size expansion and contraction, resulting in inaccurate alignment of PCB images, holes, etc., unable to drive rivets, uneven matching, etc., affecting subsequent PCB alignment And processing parts, etc. At present, the board edge image design of PCB core board is mainly copper PAD distribution or copper-free design. This design cannot improve the problem of large board size expansion and contraction after PCB pressing, especially for boards with high glue content and large glue flow. , the size expansion and contraction is larger, for some PCB processing with size expansion and contraction, and high alignment requirements, it is easy to have problems such as inaccurate alignme...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/06
CPCH05K1/0271H05K3/06
Inventor 曾梅燕王水娟
Owner GUANGDONG SHENGYI SCI TECH
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