Ultrasonic sensor packaging structure

Abstract

The invention discloses an ultrasonic sensor packaging structure, which comprises a shell and a sensor chip arranged on a working surface at the front end of an inner cavity of the shell, and furthercomprises an elastic gasket arranged in the inner cavity of the shell and pressed on the rear surface of the sensor chip. The elastic gasket is adopted, so that an oscillation starting effect can be achieved, the sensitivity of the sensor chip can be effectively improved, and the measurement precision of the sensor is improved; the wiring board is connected with a signal line, can be connected with the sensor chip through an enameled wire, is not easy to fall off, and facilitates the access of the signal line; the wiring board, the elastic gasket and the sensor chip are attached to each otherby adopting the pressing of the support pillar, so that the oscillation starting effect of the elastic gasket is prevented from being influenced by the glue held in the gap, the elasticity of the elastic gasket is better exerted, and the inner cavity of the shell is filled to reduce the glue filling amount.

Description

technical field [0001] The invention belongs to ultrasonic sensors, in particular to an ultrasonic sensor packaging structure. Background technique [0002] At present, the common ultrasonic water meters on the market are generally glued to the working surface of the front end of the inner cavity of the shell, and then the sensor chip in the inner cavity is poured to fix it. Since the sensor chip is made of piezoelectric ceramic material, its working principle is to convert the mechanical vibration signal into an electrical signal, but the existing above-mentioned packaging method makes the chip and the housing stick together as a whole, which is not conducive to the vibration of the piezoelectric ceramic, resulting in Its detection sensitivity has not been fully and effectively brought into play, and the transmitting and receiving signals are relatively weak. In addition, the signal line of the sensor is directly welded on the chip. Due to the small solder joints, it is no...

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Problems solved by technology

Since the sensor chip is made of piezoelectric ceramic material, its working principle is to convert the mechanical vibration signal into an electrical signal, but the existing above-mentioned packaging method makes the chip and the housing stick together as a whole, which is not conducive to the vibration of the piezoelectric ceramic, resulting in

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