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Electronic device

A technology for electronic devices and supporting components, which is applied in the directions of instruments, character and pattern recognition, print image acquisition, etc., can solve problems such as affecting the quality of fingerprint images, and achieve the effect of increasing structural strength

Pending Publication Date: 2020-07-10
EGIS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, in the case of strong light or direct sunlight, there will be reflected light between the luminous display screen and the optical fingerprint recognition module under the screen, which will affect the image quality of fingerprints.

Method used

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Embodiment Construction

[0028] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It is to be understood that the appended drawings are for purposes of description and explanation, not of limitation. Components may not be shown to scale for clarity. In addition, some components and / or component symbols may be omitted in some drawings. In the specification and drawings, the same or similar component symbols are used to designate the same or similar components. When it is described that a component is "disposed on", "connected to" ... another component, without special limitation, the component may be "directly disposed on", "directly connected to" ... another component, and there may also be an intermediary components. It is contemplated that elements and features of one embodiment, where practicable, can be incorporated to advantage in another embodiment without further elaboration.

[0029] figure 1 It is a schematic diagram of ...

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Abstract

The invention provides an electronic device. The electronic device comprises a fingerprint sensing module, a display panel, a connecting layer and a plurality of supporting assemblies. The fingerprintsensing module receives the sensing light beam. The fingerprint sensing module comprises a collimation layer. The display panel is configured on the fingerprint sensing module and provides an illumination light beam to a finger to reflect a sensing light beam. The connecting layer is connected between the fingerprint sensing module and the display panel. The connecting layer is annular. The plurality of supporting assemblies are configured on the fingerprint sensing module. The supporting assemblies are opaque. The collimation layer comprises a plurality of light-transmitting holes, and the plurality of supporting assemblies are not overlapped with the plurality of light-transmitting holes in the vertical direction.

Description

technical field [0001] The invention relates to an electronic device, in particular to an electronic device with a fingerprint recognition function. Background technique [0002] In current devices, optical glue (such as solid transparent optical glue (Optically Clear Adhesive, OCA) or ultraviolet curable resin (Optically Clear Resin, OCR)) is often used to combine the light-emitting display screen and the optical fingerprint under the screen in a fully bonded manner. Identification module. However, the yield rate of devices adopting the full bonding method is low, which will cause consumption and scrapping of the light-emitting display screen during the bonding process, which will inevitably increase the cost. Therefore, controlling the bonding yield is more important than material cost. [0003] In addition, in the case of strong light or direct sunlight, reflected light will be generated between the luminous display screen and the optical fingerprint recognition module ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1318
Inventor 涂志中
Owner EGIS TECH