A piezoelectric mems microphone

A microphone and piezoelectric technology, applied in the field of piezoelectric MEMS microphones, can solve the problems of uneven stress distribution, uneven deformation, affecting the performance of microphone sensitivity, resonance peak and low frequency attenuation, etc.

Active Publication Date: 2021-06-15
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a piezoelectric MEMS microphone to solve the problem of uneven deformation of the diaphragm in the prior art due to uneven stress distribution in the processing process, which in turn affects the sensitivity, resonance peak and low frequency attenuation of the microphone. technical issues of consistency

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  • A piezoelectric mems microphone
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Embodiment Construction

[0024] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0025] It should be pointed out that the following detailed description is exemplary and intended to provide further explanation to the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0026] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that wh...

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Abstract

The present invention relates to the technical field of acoustic-electric conversion, and provides a piezoelectric MEMS microphone, including: a base with a cavity back and a piezoelectric diaphragm, the piezoelectric diaphragm includes a suspension part and a base fixing part connected to the base, The piezoelectric diaphragm also includes a support part connecting the fixed part of the base and the suspension part, and the suspension part is suspended above the back cavity through the support part. The piezoelectric MEMS microphone also includes a limit structure, and the suspension part includes a position-limiting structure. The middle film overlaps with the projection range along the vibration direction, and the limiting structure and the middle film form a fixed structure of the piezoelectric diaphragm. After the piezoelectric diaphragm is released from the oxide layer, under the action of the residual stress in the piezoelectric diaphragm, the middle film deforms upwards or downwards and connects with the corresponding limiting structure to completely release the stress and gradient stress. The application of the technical solution solves the technical problem in the prior art that the diaphragm is deformed due to uneven stress distribution in the process of processing, which further affects the consistency of performance such as the sensitivity of the microphone.

Description

【Technical field】 [0001] The invention relates to the technical field of acoustic-electric conversion, in particular to a piezoelectric MEMS microphone. 【Background technique】 [0002] Piezoelectric MEMS microphones have many advantages over traditional capacitive MEMS microphones, including dust and water resistance and higher maximum output sound pressure (AOP). Limited by the sputtering growth process of the piezoelectric film layer, the stress of the piezoelectric film layer is large and unevenly distributed, and there is a large gradient stress along the thickness direction of the film layer growth. The existence of these stresses and gradient stresses makes it impossible to avoid warping and deformation of the diaphragm, whether it is fixed around the diaphragm or locally fixed in the diaphragm. The warping and deformation of the diaphragm will further increase the gap of the vent slot, and the degree of deformation and warping is different, which is difficult to cont...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/00H04R19/04H04R7/18
CPCH04R7/18H04R19/005H04R19/04H04R2307/00
Inventor 段炼张睿
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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