Automatic auxiliary material placement device

Abstract

The invention relates to the technical field of automatic auxiliary material placement, and particularly discloses an automatic auxiliary material placement device which comprises a first feeding mechanism, a second feeding mechanism and a transferring mechanism. The transferring mechanism comprises a first support, a second support moving along the first support, a first driving piece used for driving the second support, a second driving piece arranged on the second support, a third support connected with the second driving piece, a fourth support rotationally arranged on the third support, athird driving piece used for driving the fourth support and a first cylinder clamp arranged on the fourth support and used for clamping auxiliary materials. In actual use, the first feeding mechanismsupplies the auxiliary materials automatically, the second feeding mechanism supplies circuit boards automatically, the transferring mechanism transfers the auxiliary materials supplied by the firstfeeding mechanism to the circuit boards supplied by the second feeding mechanism, automatic placement of the auxiliary materials is achieved, workers do not need to place the auxiliary materials manually, and the placement efficiency and the placement yield of the auxiliary materials are improved.

Description

technical field [0001] The invention relates to the technical field of automatic placement of auxiliary materials, and in particular discloses an automatic placement device for auxiliary materials. Background technique [0002] During the manufacturing process of the circuit board, it is necessary to package the circuit board. In the process of packaging and packaging the circuit board, it is necessary to place external auxiliary materials on the circuit board. On the one hand, the placement of auxiliary materials is inefficient and cannot meet the needs of actual production; on the other hand, manual placement by the staff will also miss placement, resulting in incorrect placement of auxiliary materials. Contents of the invention [0003] In order to overcome the shortcomings and deficiencies in the prior art, the object of the present invention is to provide an automatic placement device for auxiliary materials, which can realize automatic placement of auxiliary material...

AI Technical Summary

Problems solved by technology

[0002] During the manufacturing process of the circuit board, it is necessary to package the circuit board. In the process of packaging and packaging the circuit board, it is necessary to place external auxiliary materials on the circuit board. Manually place the materials on the circuit board. On the one hand, the placement of auxiliary materials is inefficient and cannot meet the needs of actual production;

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