A methyl silicone adhesive for LED with excellent flexibility and strong adhesion
An adhesive, silicone technology, applied in the directions of adhesive additives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of dead lights, chip and substrate peeling, large internal stress, etc.
Active Publication Date: 2022-02-22
南京科矽新材料科技有限公司
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Problems solved by technology
In the field of large-size chip packaging, due to the large contact area between the large-size chip and the substrate and the large internal stress, it is easy to crack the colloid during the reflow process of the package, causing the chip and the substrate to peel off, resulting in dead lights
Method used
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Embodiment 1
[0037] This implementation proposes a method for preparing a methyl silicone adhesive for LEDs with excellent flexibility and strong adhesion, including the following steps:
[0038] Weigh 60 parts of raw material MQ type silicone resin (molecular weight is about 11000, viscosity is about 25000mPa.s, vinyl weight fraction 4.0%) and MDQ type silicone resin 15 parts (molecular weight is about 3000, viscosity is about 7000mPa.s, vinyl weight fraction 4.0%), mix uniformly; Weigh 16 parts of crosslinking agent A (viscosity is 30mPa.s, molecular weight is 500, hydrogen mass fraction is 0.4%), crosslinking agent B 4 parts (viscosity is 60mPa.s, molecular weight 2500, hydrogen mass fraction 1.4%), mix uniformly; mix the mixture of main resin and crosslinking agent at 60°C, cool to room temperature; then add 3 parts of tackifier, inhibitor 0.4 parts of A, 0.4 parts of inhibitor B, and mix evenly again; then add 0.3 parts of catalyst and 5 parts of fillers and mix evenly; finally, after...
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Abstract
A methyl silicone adhesive for LEDs with excellent flexibility and strong adhesion, comprising the following raw materials in parts by weight: 40-80 parts of MQ type methyl vinyl silicone resin, 10-20 parts of MDQ type methyl vinyl silicone resin 10-20 parts of cross-linking agent A, 2-7 parts of cross-linking agent B, 3-7 parts of special filler, 1-5 parts of tackifier, 0.2-0.5 parts of catalyst, 0.3-0.6 parts of inhibitor A , Inhibitor B 0.3-0.6 parts; The organosilicon adhesive prepared by the present invention does not contain phenyl in the main structure after curing, and has high flexibility. At the same time, by optimizing the molecular structure of the main resin and crosslinking agent, It has effectively improved its high-temperature stability and adhesive performance, and is especially suitable for large-size chip die-bonding.
Description
technical field [0001] The invention relates to a methyl silicone adhesive for LEDs with excellent flexibility and strong adhesion, and belongs to the technical field of semiconductor light-emitting chip packaging application materials. Background technique [0002] With the development of industrial technology, energy and environmental issues have become a common topic all over the world. Due to the excellent performance of LED light sources in terms of energy saving and environmental protection, they have been widely used in many fields such as lighting, display, backlight and decoration. The fourth generation of lighting sources after lamps. Various countries and regions have also launched semiconductor lighting plans to promote the development of the LED industry, such as the "National Semiconductor Lighting Research Program" in the United States, the "Solid State Lighting Research Project" in the European Union, and the "GaN Semiconductor Development Program" in South K...
Claims
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IPC IPC(8): C09J183/07C09J183/05C09J11/08C09J11/06C09J11/04H01L33/48
CPCC09J183/04C09J11/08C09J11/06C09J11/04H01L33/48H01L2933/0033C08L2205/035C08L2205/025C08L2203/206C08K2201/006
Inventor 谈高马飞孙璇
Owner 南京科矽新材料科技有限公司