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A bubble stripping device and electroplating solution electroplating system

A stripping device and air bubble technology, which is applied in the direction of plating tank, electrolytic components, electrolytic process, etc., can solve the problems of reducing product yield, affecting the electrical connection process, missing, etc., and achieve the effect of improving product yield

Active Publication Date: 2021-02-19
厦门通富微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the electroplating solution used for electroplating contains bubbles, the bubbles will block the electroplating of the product, resulting in deformed or missing metal bumps, which will affect the subsequent electrical connection process and reduce the product yield.

Method used

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  • A bubble stripping device and electroplating solution electroplating system
  • A bubble stripping device and electroplating solution electroplating system

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0020] see figure 1 , figure 1 It is a schematic structural view of an embodiment of the bubble stripping device of the present application, and the bubble stripping device includes a hollow component 10 and a vacuum component 12 .

[0021] Specifically, the hollow component 10 includes a liquid inlet port 100, a liquid outlet port 102, and a side wall 104 located between the liquid inlet port 100 and the liquid outlet port 102, and at least part of the side ...

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Abstract

The present application discloses a bubble stripping device and an electroplating solution electroplating system. The bubble stripping device includes: a hollow component, including a liquid inlet port, a liquid outlet port, and a The side wall between them, and at least part of the side wall is formed of gas-permeable and liquid-resistant material; the vacuum component is located on the outside of the hollow component, and is used to act on the gas-permeable and liquid-resistant material from the outside, so that the Air bubbles within the liquid in the hollow component are expelled from the air-permeable liquid-resistant material. Through the above method, the present application can discharge the air bubbles in the liquid.

Description

technical field [0001] The present application relates to the technical field of electroplating, in particular to a bubble stripping device and an electroplating solution electroplating system. Background technique [0002] Electroplating is a traditional and mature surface processing technology. For example, electroplating can be used to form metal bumps on the surface of the wafer. The material of the metal bumps can be gold, copper, lead-tin alloy, etc. [0003] However, when the electroplating solution used for electroplating contains bubbles, the bubbles will block the electroplating of the product, resulting in deformed or missing metal bumps, which will affect the subsequent electrical connection process and reduce the product yield. Contents of the invention [0004] The technical problem mainly solved by this application is to provide a bubble stripping device and an electroplating solution electroplating system, which can discharge the bubbles in the liquid. [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/04C25D21/10C25D17/02
CPCC25D17/02C25D21/04C25D21/10
Inventor 张雷
Owner 厦门通富微电子有限公司