Preparation process of PCB high-frequency board for 5G base station

Abstract

The invention discloses a preparation process of a PCB high-frequency board for a 5G base station. The preparation process comprises a forming process which comprises the following steps of (1) stacking boards, namely selecting a proper cover board to be propped against the PCB high-frequency board, and adding a bonding material between the cover board and the PCB high-frequency board; and (2) milling the boards, namely forming a distance between the cutting position of a milling cutter and the PCB high-frequency board, and cutting the milling cutter into the corner position of the PCB high-frequency board. By adding the fitting material between the cover plate and the PCB high-frequency board, the fitting degree of the cover plate and the PCB high-frequency plate is higher, in addition, by controlling the cutting-in position of the milling cutter, the burrs at the edge of the appearance of the finally-formed PCB high-frequency board are few and smooth, further the manual burr treatment is not needed, the quality of the PCB high-frequency board is greatly improved, the rejection rate is reduced, the production cost of an enterprise is reduced, and the production efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a preparation process of PCB high-frequency boards for 5G base stations. Background technique [0002] With the full arrival of the 5G commercial era, all links in the communication field need to use PCBs, and the number of 5G base stations is expected to increase significantly. The peak rate of 4G is 100Mbps to 1Gbps, while 5G will provide a peak bandwidth of more than 10Gbps, 1ms delay and ultra-high-density connection, with a mobility of 500km / h and a traffic density of 10Mbps / m2. At present, my country's three major operators have entered the stage of accelerating 5G construction. Pilots have been launched for 5G scale testing and application testing. Local governments have drawn up 5G coverage timetables and accelerated infrastructure construction to achieve the goal of large-scale commercial use in 2020. Since 5G requires massive connections, the number of base stations...

AI Technical Summary

Problems solved by technology

The processing flow of PCB high-frequency boards for 5G base stations is similar to that of ordinary FR4 boards, but due to the differences between boards, it is easy to have too many edge burrs after molding during the processing of PCB high-frequency boards, which requires manual processing, which greatly affects PCB high-frequency board quality, and also increased the scrap rate, increased production costs, and reduced production efficiency