Preparation process of PCB high-frequency board for 5G base station

A preparation process and high-frequency board technology, applied in the direction of printed circuit manufacturing, laminated printed circuit boards, electrical components, etc., can solve the problems affecting the quality of PCB high-frequency boards, increase production costs, reduce production efficiency, etc. High degree, less burr, the effect of improving production efficiency

Inactive Publication Date: 2020-07-17
BOLUO KONKA EXACTITUDE SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The processing flow of PCB high-frequency boards for 5G base stations is similar to that of ordinary FR4 boards, but due to the differences between boards, it is easy to have too many edge burrs after molding during the proc

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0027] Example one

[0028] The preparation process of a PCB high-frequency board for 5G base stations of the present invention includes a forming process, and the forming process includes:

[0029] (1) Stacking treatment: select a cover plate with appropriate specifications and dimensions, and abut the cover plate with the PCB high-frequency board, and set up a bonding material between the cover plate and the PCB high-frequency board;

[0030] (2) Gong board processing: control the lower knife position of the gong knife. There is a gap between the lower knife position of the gong knife and the PCB high-frequency board, and the gong knife cuts in at the corner of the PCB high-frequency board.

[0031] Preferably, the bonding material is kraft paper or white paper. Specifically, the bonding material is 1 piece of kraft paper or 2-3 pieces of white paper, so that the cover plate and the PCB high-frequency board are more closely bonded.

[0032] Preferably, the cover board is any one of p...

Example Embodiment

[0049] Example two

[0050] The preparation process of a PCB high-frequency board for 5G base stations of the present invention includes a forming process, and the forming process includes:

[0051] (1) Stacking treatment: select a cover plate with appropriate specifications and dimensions, and abut the cover plate with the PCB high-frequency board, and set up a bonding material between the cover plate and the PCB high-frequency board;

[0052] (2) Gong board processing: control the lower knife position of the gong knife. There is a gap between the lower knife position of the gong knife and the PCB high-frequency board, and the gong knife cuts in at the corner of the PCB high-frequency board.

[0053] Preferably, the bonding material is kraft paper or white paper. Specifically, the bonding material is 1 piece of kraft paper or 2-3 pieces of white paper, so that the cover plate and the PCB high-frequency board are more closely bonded.

[0054] Preferably, the cover board is any one of p...

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PUM

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Abstract

The invention discloses a preparation process of a PCB high-frequency board for a 5G base station. The preparation process comprises a forming process which comprises the following steps of (1) stacking boards, namely selecting a proper cover board to be propped against the PCB high-frequency board, and adding a bonding material between the cover board and the PCB high-frequency board; and (2) milling the boards, namely forming a distance between the cutting position of a milling cutter and the PCB high-frequency board, and cutting the milling cutter into the corner position of the PCB high-frequency board. By adding the fitting material between the cover plate and the PCB high-frequency board, the fitting degree of the cover plate and the PCB high-frequency plate is higher, in addition, by controlling the cutting-in position of the milling cutter, the burrs at the edge of the appearance of the finally-formed PCB high-frequency board are few and smooth, further the manual burr treatment is not needed, the quality of the PCB high-frequency board is greatly improved, the rejection rate is reduced, the production cost of an enterprise is reduced, and the production efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a preparation process of PCB high-frequency boards for 5G base stations. Background technique [0002] With the full arrival of the 5G commercial era, all links in the communication field need to use PCBs, and the number of 5G base stations is expected to increase significantly. The peak rate of 4G is 100Mbps to 1Gbps, while 5G will provide a peak bandwidth of more than 10Gbps, 1ms delay and ultra-high-density connection, with a mobility of 500km / h and a traffic density of 10Mbps / m2. At present, my country's three major operators have entered the stage of accelerating 5G construction. Pilots have been launched for 5G scale testing and application testing. Local governments have drawn up 5G coverage timetables and accelerated infrastructure construction to achieve the goal of large-scale commercial use in 2020. Since 5G requires massive connections, the number of base stations...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0044H05K3/0058
Inventor 雷仁庆曹兵钟晓环张炜王太平刘文华尹国强
Owner BOLUO KONKA EXACTITUDE SCI TECH
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