Reaction chamber of semiconductor equipment and semiconductor equipment

A reaction chamber and semiconductor technology, applied in semiconductor/solid-state device manufacturing, discharge tubes, electrical components, etc., can solve the problems of unbalanced wafer adsorption force, low safety and reliability of semiconductor equipment, etc. The effect of circular deflection, improved safety and reliability, and balanced adsorption force

Active Publication Date: 2020-07-24
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention discloses a reaction chamber of a semiconductor device and the semiconductor device to solve the problem of low safety and reliability of the semiconductor device due to the unbalanced adsorption force of the electrostatic chuck to the wafer

Method used

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  • Reaction chamber of semiconductor equipment and semiconductor equipment
  • Reaction chamber of semiconductor equipment and semiconductor equipment
  • Reaction chamber of semiconductor equipment and semiconductor equipment

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Embodiment Construction

[0024] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] Such as Figure 1 to Figure 4 As shown, the embodiment of the present invention discloses a reaction chamber of a semiconductor device. The disclosed reaction chamber may specifically in...

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Abstract

The invention discloses a reaction chamber of semiconductor equipment and the semiconductor equipment. The reaction chamber comprises a chamber body, and an electrostatic chuck, a compensation voltagedetection device and a lower electrode which are arranged from top to bottom. The chamber body is provided with a reaction cavity; the electrostatic chuck, the compensation voltage detection device and the lower electrode are arranged in the reaction cavity, and the electrostatic chuck is used for supporting a wafer; one end of the compensation voltage detection device penetrates through the electrostatic chuck, is in contact with the wafer and is electrically connected with the wafer, and the other end of the compensation voltage detection device is connected with the lower electrode; and the compensation voltage detection device is used for measuring the voltage of the wafer and compensating the adsorption voltage of the electrostatic chuck according to the detected voltage of the wafer. According to the scheme, the problem of relatively low safety and reliability of the semiconductor equipment due to unbalanced adsorption force of the electrostatic chuck to the wafer can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip manufacturing, in particular to a reaction chamber of a semiconductor device and the semiconductor device. Background technique [0002] With the rapid development of science and technology, electronic products such as smartphones and tablet computers have become indispensable products in modern life. These electronic products include many semiconductor chips inside, and the main manufacturing material of semiconductor chips is wafer. The wafer needs to be etched with a circuit pattern, and semiconductor equipment is usually used to etch the wafer. [0003] Taking the etching machine as an example, the etching machine can include a chamber body, a lower electrode and an electrostatic chuck. The chamber body has a reaction chamber, the lower electrode and the electrostatic chuck are located in the reaction chamber, and the wafer is placed on the electrostatic chuck. , and the lower ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67H01J37/20
CPCH01L21/6831H01L21/6833H01J37/20H01L21/67253Y02P70/50
Inventor 刘建
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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