Laminating process of aluminum substrate
A lamination process and aluminum substrate technology, applied in lamination, lamination devices, layered products, etc., can solve problems affecting production efficiency, time-consuming, long completion time, etc., to improve board-forming efficiency and save time Effect
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[0023] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0024] Such as figure 1 As shown, this embodiment includes the following steps,
[0025] The positioning hole processing step is to process the positioning slot holes on the prepreg 2 and the substrate 3;
[0026] Etching step, the substrate 3 is etched;
[0027] The stacking step is to stack the plates in the carrier tray to form the primary plate body;
[0028] Heating step, copper foil 1, prepreg 2 and substrate 3 such as figure 2 The primary plates stacked in sequence as shown are heated to a rated high temperature until the prepreg 2 is heated to a liquid state;
[0029] Lamination step, using a laminator to laminate the primary board body at a high temperature rating;
[0030] In the cooling step, the primary plate body in lamination is cooled to a rated low temperature to form a secondary plate body, and the primary plate body is cooled to a rate...
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