A time-controlled intermittent life test method with real-time correction according to junction temperature

Abstract

A time-controlled intermittent life test method based on real-time correction of junction temperature, comprising the following steps: selecting samples for pre-testing, determining the heating time of a specific device under driving power to reach the junction temperature variation required by the test, and recording the junction temperature drop to The time of initial temperature; the heating time determined by the pre-test is used as the heating period of the cycle period, and a constant driving power is continuously applied during the heating period. The time is used as a cooling cycle to cool down the device. After the cooling cycle ends, if the junction temperature does not reach the initial temperature, the second cooling cycle is continued; the next cycle is equal to the sum of the cooling cycle and the second cooling cycle time of the previous cycle. The invention can more strictly simulate the intermittent working state of the components, and more accurately meet the requirements of the intermittent life test.

Description

technical field [0001] The invention belongs to the field of semiconductor reliability test, and particularly relates to a time-controlled intermittent life test method corrected in real time according to junction temperature. Background technique [0002] Intermittent life test is an important test item to ensure the quality and reliability of semiconductor discrete devices. The reliability of the device is checked by repeatedly energizing and de-energizing the device, and applying stress to the device regularly and intermittently. At present, most manufacturers monitor the junction temperature change required by the test by measuring the device case temperature when actually performing the intermittent life test. Due to the differences in monitoring methods and standards, the temperature difference between the junction temperature and the case temperature of devices in different heat dissipation environments and different packaging forms may be large, and the monitoring ca...

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Problems solved by technology

[0003] The object of the present invention is to solve the problem of insufficient accuracy of the intermittent life test in the prior art, to provide a time-controlled intermittent life test method based on real-time correction of the junction temperature, and to replace the case temperature measurement by the junction temperature measurement, thereby improving the junction temperature measurement The accuracy of the value; in the test process, by introducing feedback and modifying the cooling time in the test according to the junction temperature change, the reliability of the device and the compliance of the test conditions with the requirements of the national military standard can be more reasonably inspected

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