Camera module attaching system and method for improving arrangement reliability

Abstract

The invention relates to a camera module attaching system and a camera module attaching method using the same. The system includes: a module conveying part that conveys a first tray containing a plurality of modules in a certain forward direction; an FPCB conveying part including: an FPCB input part that puts in a second tray containing a plurality of FPCB substrates, and discharges the second tray The FPCB discharge part of the module transports the second tray at a position that does not intersect with the module delivery part; the ACF attachment part attaches the ACF to the upper surface of the module; The upper side of the FPCB is attached to the upper side of the FPCB; the thermal hardening part applies heat to the ACF between the module and the FPCB to harden it; and the control part controls the plurality of structures; On the upper side of one place, ACF is pasted on the upper side of the module; the FPCB input part and the FPCB discharge part are arranged on the front surface of the system.

Description

technical field [0001] The present invention relates to a system and a manufacturing method for manufacturing camera modules, and more particularly to a camera module attaching system and a camera module attaching method using the system for improving arrangement reliability, which does not prevent modules that are not properly accommodated in a tray. Attachment with different attachment structure is carried out. Background technique [0002] A general camera module is a general term for components that use an image sensor to convert optical signals entering through a lens into RGB electrical signals and display them on the screens of digital imaging devices such as mobile phones and monitors. That is, it is an essential component for taking and storing photos in mobile devices such as smartphones. It can sense the movement of objects such as human facial expressions and hand movements to operate digital devices, so its application field has expanded to input devices. [00...

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Problems solved by technology

[0005] However, when the camera module is manufactured by the method described in the above-mentioned prior art document, since the step of confirming the arrangement of the structure is not performed in the middle of the process, there is a problem that the occurrence rate of defective products may increase.

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