The application discloses an
infrared light-curing
epoxy adhesive and a preparation method thereof, and belongs to the technical field of adhesives. The
adhesive contains, in terms of weight fractions, 48-70 parts of an
epoxy resin, 15-40 parts of a
thiol curing agent, 5-10 parts of a latent curing agent and 0.05-4 parts of an
infrared absorber. The
infrared absorber is a
selenium-containing squarylium compound with a symmetrical D-B-A-B-D structure, which is composed of a squarylium unit, a fused ring azulen unit and a 2-arylbenzo[d][1,3]selenazole unit. Through the heavy atom effect of
selenium and the J-aggregation
synergy of the fused ring azulen, the photo-thermal conversion efficiency is greater than or equal to 80%, and strong absorption is achieved in the 700-1500 nm near-infrared region. The
adhesive can also optionally contain
tungsten oxide with a
mass ratio of (0.2-5):1, so as to further improve the photo-thermal conversion efficiency to greater than or equal to 90%. The adhesive can be stored at -18 DEG C for more than or equal to 6 months (the
viscosity growth rate is less than 50%), can be cured by near-
infrared irradiation for 10-60 seconds, has a curing depth of more than or equal to 2 mm, a
shear strength of more than or equal to 10 MPa, a Tg of more than or equal to 60 DEG C, and a
moisture and
heat resistance retention rate of more than or equal to 85%, and is suitable for electronic precision
assembly, optical device packaging and other heat-sensitive scenes.