Memory bank manufacturing device for quantitative solder paste scraping based on intermittent movement

A production device and intermittent technology, applied in the direction of tin feeding device, manufacturing tools, metal processing equipment, etc., can solve the problems of raw material waste, high cost, inconsistent chip bonding, etc., achieve convenient and intelligent operation, increase pass rate, increase The effect of practicality

Active Publication Date: 2020-08-18
杭州海类科技有限公司
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  • Summary
  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] Memory, also known as main memory, is a storage space that can be directly addressed by the CPU. It is made of semiconductor devices. The memory is characterized by fast access speed. Memory is the main component of the computer. , Programs and hardware put forward higher requirements for memory performance. In order to increase speed and expand capacity, memory must appear in an independent package, so the concept of memory sticks was born. The production of memory sticks mainly includes preparation work, scraping solder paste, There are several main steps such as inspection, function test, and packaging. Among them, automatic solder paste dispenser and manual solder paste scraping are generally used when scraping solder paste. The automatic solder paste dispenser is relatively large and is generally suitable for batch operations in large enterprises. , it is not suitable for small and medium-sized enterprises to operate, and the cost is relatively high. For the traditional manual scraping of solder paste, it is usually necessary to use a scraper to scrape the solder paste out of the bottle during the process of scraping the solder paste. Then scrape the surface of the memory stick. Due to errors in manual operation, it is impossible to ensure that the amount of solder paste scraped out is consistent each time. For a long time, it is easy to cause solder paste to accumulate. On the one hand, it will cause waste of raw materials, and on the other hand, it will cause inconsistent chip bonding. When the solder paste is scraped out less, good adhesion cannot be guaranteed, resulting in chips that cannot be pasted normally. Repeat the operation, thus prolonging the time of the entire operation process, which is time-consuming and laborious
[0004] In order to solve the above problems, the inventor proposed a memory stick production device based on intermittent movement and quantitative scraping of solder paste, which has the advantages of low cost and quantitative solder paste scraping, and solves the problem of high cost of traditional solder paste scraping machines. The time-consuming and labor-intensive problem of manually scraping solder paste ensures that the operation of this device is more time-saving and labor-saving, and it is more uniform during the entire scraping of solder paste

Method used

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  • Memory bank manufacturing device for quantitative solder paste scraping based on intermittent movement
  • Memory bank manufacturing device for quantitative solder paste scraping based on intermittent movement
  • Memory bank manufacturing device for quantitative solder paste scraping based on intermittent movement

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see Figure 1-4 , a memory stick production device based on intermittent movement and quantitative scraping of solder paste, including a housing 1, the outer side of the housing 1 is provided with an anti-slip pad, and the anti-slip pad is designed as rubber with particles on the surface to increase the friction when holding and feel, to avoid slipping, the inside of the shell 1 is fixedly connected with the storage room 2, and the storage room 2 is use...

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Abstract

The invention relates to the technical field of computer memory, and discloses a memory bank manufacturing device for quantitative solder paste scraping based on the intermittent movement. A shell isincluded. Through cooperative usage of a storage chamber, sector gears, first connecting rods and baffles, the storage chamber is automatically opened and closed. A scraper is utilized for solder paste scraping, and manual multi-time solder paste scraping-out is not needed. Through cooperative usage of a piston, a push rod, a second connecting rod and a first rotation wheel, solder paste is automatically extruded, the extrusion amount each time is consistent, and quantitative solder paste scraping is conducted. During operation, scraping is more uniform, and stacking caused by the too large solder paste amount or uneven scraping caused by the tool small solder paste amount is avoided, and the product qualification rate is increased. Through cooperative usage of a second rotation wheel, a rotation shaft, a third connecting rod, a half gear and a small gear, the two steps of solder paste extrusion and baffle opening are in linkage, accordingly, linkage performance of the whole device isimproved, operation is more simple, and practicability of the whole device is improved.

Description

technical field [0001] The invention relates to the technical field of computer memory, in particular to a memory stick manufacturing device based on intermittent movement and quantitative scraping of solder paste. Background technique [0002] The memory is one of the important parts in the computer. Its function is to temporarily store the calculation data in the CPU and the data exchanged with the external storage such as the hard disk. All programs in the computer are run in the memory, so the memory Performance has a huge impact on your computer. [0003] Memory, also known as main memory, is a storage space that can be directly addressed by the CPU. It is made of semiconductor devices. The memory is characterized by fast access speed. Memory is the main component of the computer. , Programs and hardware put forward higher requirements for memory performance. In order to increase speed and expand capacity, memory must appear in an independent package, so the concept of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/06
CPCB23K3/06B23K3/0638
Inventor 王子轩
Owner 杭州海类科技有限公司
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