A jig for carrying a wafer cassette, a wafer cassette device, and a method for loading wafers

Abstract

The present application discloses a jig for carrying a wafer cassette, a wafer cassette device and a method for loading wafers. The jig for carrying the wafer cassette includes: a wedge-shaped carrier, a groove is provided on the inclined surface of the wedge-shaped carrier, the bottom of the groove includes a hollow area and a non-hollow area, and the non-hollow area is used to carry the edge of the frame, so that the At least part of the frame is located in the groove; the lifting and lifting assembly includes a driving member and a lifting arm connected with the driving member, and the lifting arm acts on the wafer at the corresponding position from the hollow area of ​​the groove under the action of the driving member The wafers in the carrying area are staggered from other adjacent wafers, and the markings on the surface of the wafers are exposed. The jig for carrying the wafer cassette provided by the present application can lift the wafer by using the lifting arm to expose the engraving number, save the operation of manually clamping the wafer, and reduce the damage of the wafer caused by clamping. And it is convenient to read the engraved number and check the engraved number.

Description

technical field [0001] The present application relates to the field of semiconductor technology, and in particular, to a jig for carrying a wafer cassette, a wafer cassette device and a method for loading wafers. Background technique [0002] Each wafer in a wafer fab in the semiconductor industry has a separate code and engraving number, which is used to distinguish it from other wafers in each process flow, and also to trace the production history when problems are found. In order to facilitate production management, each wafer must be placed in the wafer cassette in the order recorded in the production data. Otherwise, the production data and actual wafers may not correspond to each other after production is completed, resulting in production chaos and economic losses. Wafer factories below 12 inches generally adopt the method of manually clamping the wafer and manually reading the engraving number for verification, which is inconvenient to operate and prone to errors. It...

AI Technical Summary

Problems solved by technology

In order to facilitate production management, each wafer must be placed in the wafer magazine according to the order recorded in the production data, otherwise, the production data and the actual wafer may not correspond to each other after production, resulting in production confusion and economic losses

Wafer factories below 12 inches generally adopt the method of manually picking up the wafer and manually reading the engraved number for verification, which is inconvenient to operate and prone to errors. It is necessary to develop a jig that is convenient for reading the engraved wafer number

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