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Finished product testing method and device and circuit board testing method and device

A test method and circuit board technology, applied in the direction of measuring devices, measuring electricity, measuring electrical variables, etc., can solve the problems of high cost and low efficiency, and achieve the effect of improving efficiency and reducing hardware cost

Pending Publication Date: 2020-09-01
GUANGDONG TRANSTEK MEDICAL ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiments of the present application is to provide a finished product testing method, a circuit board testing method and a device to solve the technical problems of high cost and low efficiency when testing electronic products

Method used

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  • Finished product testing method and device and circuit board testing method and device
  • Finished product testing method and device and circuit board testing method and device
  • Finished product testing method and device and circuit board testing method and device

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Embodiment Construction

[0054] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0055] During the production process of electronic products, a series of tests usually need to be completed on the production line before they can be put on the market for sale. The length of the test time is related to the production cost, the comprehensiveness of the test is related to the product quality, and the product quality seriously affects the market reputation and after-sales costs. Therefore, it is particularly important to test the electronic products before launching them.

[0056] One of the most important components in electronic products is the circuit board with communication function made by Printed Circuit Board Assembly (PCBA) process. The finished circuit boards are tested. When testing the circuit board and the finished product, it is necessary to use the test firmware to tes...

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Abstract

The invention provides a finished product testing method and device and a circuit board testing method and device, and the finished product testing method comprises the steps of testing a to-be-testedfinished product through testing firmware, burnt in advance, in a controller of a qualified to-be-tested circuit board; and when the to-be-tested finished product is qualified, sending a recovery instruction to the qualified to-be-tested finished product, thereby enabling the qualified to-be-tested finished product to replace the test firmware in the controller by using formal firmware pre-programmed in an external memory of the to-be-tested circuit board. Therefore, the formal firmware is pre-programmed in the external memory of the to-be-tested circuit board; the test firmware is burnt in the controller of the to-be-tested circuit board, so that program space occupation caused by burning of formal firmware and the test firmware in the same place can be avoided, hardware cost is reduced,secondary burning after testing is not needed, and testing efficiency is improved. In addition, a communication interface does not need to be reserved on a to-be-tested finished product, and the purposes of attractiveness, waterproofness and the like can be achieved.

Description

technical field [0001] The present application relates to the field of circuit testing, in particular, to a finished product testing method, a circuit board testing method and a device. Background technique [0002] Electronic products need to complete a series of tests before being put on the market for sale. The existing testing process includes doing a test pattern on the official firmware, or burning the test firmware during the test and burning the official firmware after the test is completed. However, the method of including the test mode in the official firmware takes up the program space and increases the hardware cost; if the official firmware is burned after the test is completed, the finished product needs to be burned twice. When the finished product does not have a communication interface reserved It cannot be realized. Even if the finished product has a communication interface reserved, the efficiency is low due to the need for multiple programming. Content...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28H04L29/12
CPCG01R31/2832H04L2101/622
Inventor 不公告发明人
Owner GUANGDONG TRANSTEK MEDICAL ELECTRONICS CO LTD
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