Mask alignment mark combination, mask alignment system and alignment method, and photoetching device

Abstract

The invention provides a mask alignment mark combination, a mask alignment system and alignment method, and a photoetching device. The mask plate comprises two groups of alignment marks in the X direction and two groups of alignment marks in the Y direction, wherein the two groups of alignment marks in the X direction and the two groups of alignment marks in the Y direction are symmetrically arranged relative to the center of the mask plate. During mask alignment, a radiation detection assembly receives an alignment light beam passing through a mask alignment mark combination, a projection assembly and a benchmark reference mark combination in sequence and obtains alignment position information corresponding to each group of alignment marks, a calculation assembly can obtain pose information of a benchmark plate according to the multiple pieces of alignment position information, and the pose information of the benchmark plate can accurately express the relative position relation between the benchmark plate and the mask plate.

Description

technical field [0001] The invention relates to the technical field of photolithography, in particular to a mask alignment mark combination, a mask alignment system and alignment method, and a photolithography device. Background technique [0002] As a key subsystem of the lithography machine, the mask alignment system is used to measure the relative position of the mask alignment mark combination on the mask plate relative to the reference reference mark combination on the reference plate, and then obtain the relationship between the reference plate and the mask plate. relative position. The combined layout of mask alignment marks on the existing mask can only measure the position information (x, y, z) of the reference plate, but cannot measure the attitude information (Rx, Ry, Rz) of the reference plate, so it is not The positional relationship between the reference plate and the mask plate cannot be accurately expressed. Contents of the invention [0003] The object o...

AI Technical Summary

Problems solved by technology

The combined layout of mask alignment marks on the existing mask can only measure the position information (x, y, z) of the reference plate, but cannot measure the attitude information (Rx, Ry, Rz) of the reference plate, so it is not The positional relationship between the reference plate and the mask plate cannot be accurately expressed

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