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Mechanical combination type heat dissipation computer case

A combined, computer technology, applied in computing, instrumentation, electrical and digital data processing, etc., can solve the problems of high power requirements, poor heat dissipation, complex structure, etc., and achieve low power requirements, low cost, and good heat dissipation. Effect

Inactive Publication Date: 2020-09-08
杭州康桔科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a mechanical combined heat dissipation computer case, which has the advantages of low noise, good heat dissipation effect, low power requirement, simple and reliable structure, and low cost, and solves the problem of high noise and heat dissipation effect. Poor, high power requirements, complex structure, high cost and other shortcomings

Method used

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  • Mechanical combination type heat dissipation computer case
  • Mechanical combination type heat dissipation computer case
  • Mechanical combination type heat dissipation computer case

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] see Figure 1-5 , a mechanically combined heat dissipation computer case, comprising a casing 1, a heat dissipation plate 4, a fan bracket 5 and a side plate 10, the left side of the casing 1 is fixedly connected with a main board part 2, and the upper end of the casing is fixedly connected with a graphics card part 3 for heat dissipation The left side and the upper and lower sides of the board 4 are fixedly connected with a rivet-6, and the cooling pla...

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Abstract

The invention relates to the technical field of computer cases and discloses a mechanical combination type heat dissipation computer case, which comprises a shell, a heat dissipation plate, a fan bracket and a side plate, the left side of the interior of the shell is fixedly connected with a mainboard part. The upper end in the shell is fixedly connected with a display card part; rivets I are fixedly connected to the left side, the upper side and the lower side of the heat dissipation plate; rivets II are fixedly connected to the upper side and the lower side of the fan support, two fans are fixedly connected to the middle of the fan support, antiskid rubber is fixedly connected to the bottom of the outer side of the shell, heat dissipation holes are formed in the front face and the back face of the shell and the surfaces of the side plates, and magnets are fixedly connected to the outer side surface of the shell and the surfaces of the side plates. According to the mechanical combination type heat dissipation computer case, the fan and the heat dissipation plate are used in cooperation, and therefore the effects of being low in noise, good in heat dissipation effect, low in powerrequirement of a power source, simple and reliable in structure and low in cost are achieved.

Description

technical field [0001] The invention relates to the technical field of computer accessories, in particular to a mechanically combined heat dissipation computer case. Background technique [0002] As a part of computer accessories, the chassis is mainly used to place and fix various computer accessories, and play a supporting and protective role. The chassis generally includes a shell, a bracket, various switches on the panel, and indicator lights. The shell is made of steel plate and plastic, with high hardness, mainly to protect the internal components of the chassis; the bracket is mainly used to fix the motherboard, power supply and various drives. [0003] For a long time, due to the small space inside the computer case, too many integrated circuits, the problem of serious heating inside the computer has always affected the development of hardware. There are mainly two heat dissipation methods on the market, air cooling and water cooling, but there will be disadvantages...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/183G06F1/20
Inventor 黄加林
Owner 杭州康桔科技有限公司
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