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CPU plate type heat dissipation device

A heat dissipation device, CPU board technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of inability to adjust heat dissipation efficiency, CPU burnout, fixed structure of CPU heat dissipation device, etc.

Pending Publication Date: 2020-09-08
惠州市建文鑫五金制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] A CPU plate heat dissipation device proposed by the present invention solves the problem that the existing CPU heat dissipation device has a fixed structure, cannot adjust its heat dissipation efficiency, and easily causes the CPU to burn out

Method used

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  • CPU plate type heat dissipation device
  • CPU plate type heat dissipation device
  • CPU plate type heat dissipation device

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0023] refer to Figure 1-4 , a CPU plate heat sink, including a CPU body 1, a mounting ring 2, a fixing frame 3, and a cooling fan 5, two symmetrically distributed fixing frames 3 are installed on the CPU body 1, and the fixing frame 3 is provided with There are sockets 9, the mounting ring 2 is located between the two fixing frames 3, and the circumferential side wall of the mounting ring 2 is fixedly connected with two symmetrically distributed mounting plates 10, the mounting plates 10 The top end is fixedly connected with an insertion rod 4, and the insertion rod 4 matches the jack 9, the bottom end of the installation plate 10 is fixedly connected with a liftin...

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Abstract

The invention discloses a CPU plate type heat dissipation device and relates to the field of CPU heat dissipation. The device is provided to solve the following problems in the prior art that: existing CPU heat dissipation devices are fixed in structure; the heat dissipation efficiency cannot be adjusted; and CPUs are easy to burn down. The invention provides the following scheme: the device comprises a CPU body, mounting ring fixing frames and a cooling fan, wherein two fixing frames which are symmetrically distributed are mounted on the CPU body; the fixing frames are fixedly connected withthe mounting ring, inserting holes are formed in the fixing frames, the mounting ring is located between the two fixing frames, two symmetrically-distributed mounting plates are fixedly connected to the circumferential side wall of the mounting ring, inserting rods are fixedly connected to the top ends of the mounting plates, and the inserting rods are matched with the inserting holes. The CPU plate type heat dissipation device is novel in structure, the number of the heat radiation plates can be changed according to use requirements, the heat radiation efficiency of a CPU is changed to protect the CPU, and meanwhile the heat dissipation device can be conveniently assembled and disassembled from the CPU plate.

Description

technical field [0001] The invention relates to the field of CPU cooling, in particular to a CPU plate cooling device. Background technique [0002] The central processing unit is one of the main devices of an electronic computer and the core component of a computer. Its function is mainly to interpret computer instructions and process data in computer software. All operations in the computer are the core components that the CPU is responsible for reading instructions, decoding instructions, and executing instructions. When the CPU is working, it will generate a lot of heat. If the heat is not dissipated in time, it will cause a crash, or burn the CPU. The CPU radiator is used to dissipate heat for the CPU. CPU radiators can be divided into three types according to their heat dissipation methods: air cooling, heat pipe cooling and water cooling. Air Cooled Radiator This is the most common type of radiator today and consists of a cooling fan and a heat sink. The principle...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 邓健文卢相逢朱启祥胡为光郭秀平陆学顺余愿望
Owner 惠州市建文鑫五金制品有限公司