CPU plate type heat dissipation device
A heat dissipation device, CPU board technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of inability to adjust heat dissipation efficiency, CPU burnout, fixed structure of CPU heat dissipation device, etc.
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[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0023] refer to Figure 1-4 , a CPU plate heat sink, including a CPU body 1, a mounting ring 2, a fixing frame 3, and a cooling fan 5, two symmetrically distributed fixing frames 3 are installed on the CPU body 1, and the fixing frame 3 is provided with There are sockets 9, the mounting ring 2 is located between the two fixing frames 3, and the circumferential side wall of the mounting ring 2 is fixedly connected with two symmetrically distributed mounting plates 10, the mounting plates 10 The top end is fixedly connected with an insertion rod 4, and the insertion rod 4 matches the jack 9, the bottom end of the installation plate 10 is fixedly connected with a liftin...
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