A kind of adapter board and its manufacturing method that are easy to fill in the bottom of SIP package
A technology of underfilling and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as insufficient filling, plastic packaging compound filling, product failure, etc., and increase the filling space , Guarantee complete filling, and ensure the effect of product reliability
Active Publication Date: 2022-06-28
JCET GROUP CO LTD
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Problems solved by technology
[0002] At present, some large SIP products are directly surface-mounted with relatively large-sized QFN or LGA products and directly filled with plastic encapsulants. However, the bottom spacing of these products is generally less than 50um after surface-mounting, and it is difficult for the plastic encapsulant to completely fill the bottom. , there will be insufficient filling, which may lead to failure of subsequent products
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[0034] The present invention will be further described in detail below with reference to the embodiments of the accompanying drawings.
[0035] see figure 1 , the present invention relates to an adapter board that is easy to fill the bottom of SIP package, which includes a solder layer 2, and a plastic sealing compound 3 is filled between the solder layers 2, and the upper surface of the plastic sealing compound 3 is not higher than the solder layer 2. On the upper surface, the upper surface of the solder layer 2 is provided with a copper pillar layer 4, the pattern of the copper pillar layer 4 corresponds to the pattern of the solder layer 2, and the lower surface of the solder layer 2 and the plastic sealing compound 3 is provided with a mucous membrane layer 1, so The mucous membrane layer 1 is provided with a window 5 at the position of the solder layer;
[0036] The size of the adapter board is the same as the size of the mounted component or slightly larger than the siz...
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Abstract
The invention relates to an adapter board which is easy to fill the bottom of SIP packaging and a manufacturing method thereof. The adapter board includes a solder layer (2), and the periphery of the solder layer (2) is filled with a plastic encapsulant (3). The upper surface of the plastic encapsulant (3) is not higher than the upper surface of the solder layer (2), and the upper surface of the solder layer (2) is provided with a copper column layer (4), and the pattern of the copper column layer (4) is consistent with the solder layer ( 2) Corresponding to the graphics, the lower surface of the solder layer (2) and the molding compound (3) is provided with a mucous layer (1), and the mucous layer (1) is provided with a window (5) at the position of the solder layer (2) ). The invention discloses an adapter board which is easy to fill in the bottom of SIP packaging and a manufacturing method thereof, which can raise the gap at the bottom of a surface mounting device and make it easier to fill in plastic packaging compound.
Description
technical field [0001] The invention relates to a transfer board which is easy to underfill SIP package and a manufacturing method thereof, and belongs to the technical field of semiconductor packaging. Background technique [0002] At present, some large-sized SIP products directly surface mount QFN or LGA products with relatively large size and directly underfill with plastic sealing compound. However, the bottom spacing of these products is generally less than 50um after surface mounting, and it is difficult for plastic packaging material to completely fill the bottom. , there will be insufficient filling, which may lead to the failure of subsequent products. SUMMARY OF THE INVENTION [0003] The technical problem to be solved by the present invention is to provide an adapter board that is easy to fill the bottom of the SIP package and its manufacturing method in view of the above-mentioned prior art. . [0004] The technical solution adopted by the present invention ...
Claims
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IPC IPC(8): H01L23/498H01L21/48H01L21/60
CPCH01L23/49816H01L23/49838H01L21/4853H01L24/81H01L2224/81345
Inventor 李全兵顾骁宋健
Owner JCET GROUP CO LTD