Image feedback multi-MEMS device piezoelectric automatic pick-and-place robot and control method thereof

A robot and device technology, applied in image communication, color TV parts, TV system parts and other directions, can solve the problems of time-consuming and labor-intensive cost, easy damage, poor pick-and-place effect, etc., to improve the pick-and-place accuracy , reduce uncertainty and improve pick and place efficiency
CN111646196AActive Publication Date: 2020-09-11ZHENGZHOU UNIVERSITY OF LIGHT INDUSTRY

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ZHENGZHOU UNIVERSITY OF LIGHT INDUSTRY
Publication Date
2020-09-11

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Abstract

The invention belongs to the field of a micro-electromechanical integration technology and a micro-nano technology, and particularly relates to an image feedback multi-MEMS device piezoelectric automatic pick-and-place robot and a control method thereof. The robot comprises a base platform, wherein a circumferential rotation unit, an automatic pick-and-place device, a piezoelectric adjustable sample table and a liftable image detection unit are sequentially fixed on the base platform from left to right, the automatic pick-and-place device can smoothly pick up MEMS devices arranged on the circumferential rotation unit through cooperation among the circumferential rotation unit, the automatic pick-and-place device, the piezoelectric adjustable sample table and the liftable image detection unit, the MEMS devices are transferred to the piezoelectric adjustable sample table, and the robot has the advantages of automation in operation, high pick-and-place precision and high efficiency.
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Description

technical field

[0001] The invention belongs to the fields of micro-electromechanical integration technology and micro-nano technology, and in particular relates to an image feedback piezoelectric automatic pick-and-place robot with multiple MEMS devices and a control method thereof. Background technique

[0002] Micro-electromechanical systems (MEMS) devices, as an important common test device in the field of micro-nano-level testing, are widely used in the fields of micro-nano operation and measurement due to their relatively high test efficiency, high test accuracy, and high sensitivity. Generally speaking, according to different test tasks and application requirements, there will be situations where different functional MEMS devices need to be replaced multiple times. Therefore, the pick-and-place operation of MEMS devices has become a decisive link to ensure the normal operation of MEMS devices. At present, the commonly used pick-and-place method for replacing MEMS devi...

Claims

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