Semiconductor packaging method

Abstract

The invention provides a semiconductor packaging method, which comprises the following steps: mounting a plurality of to-be-packaged chips on a carrier plate, so that a plurality of mounting areas onwhich the plurality of to-be-packaged chips are mounted and blank areas surrounding the mounting areas are formed on the carrier plate; placing a mold frame in the blank areas on the carrier plate, wherein the mold frame is of a closed structure, a plurality of hollowed-out areas are arranged in the mold frame, and the hollowed-out areas correspond to the mounting areas one to one; and forming anencapsulation layer, wherein the encapsulation layer covers the carrier plate, fills the hollow area of the mold frame, and is used for encapsulating the plurality of to-be-packaged chips.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a semiconductor packaging method. Background technique [0002] Common semiconductor packaging technology, such as chip packaging technology, mainly includes the following process: first, the front of the die is bonded to the carrier board with adhesive tape, then heat-pressed and molded, and then the carrier board is peeled off, and the rewiring process is performed on the front side of the die , forming a rewiring structure, and encapsulating. [0003] like Figure 1(a)-Figure 1(c) As shown, in the heat-compression molding process, the molded resin material 1 moves vertically and left and right in the mold cavity under the action of the upper pressure plate 2 of the molding machine, so that the molded resin material 1 is evenly distributed and compacted The encapsulation layer 4 is formed on the surface of the carrier board 3 after solidification, but the left...

AI Technical Summary

Problems solved by technology

[0003] like Figure 1(a)-Figure 1(c) As shown, in the heat-compression molding process, the molded resin material 1 moves vertically and left and right in the mold cavity under the action of the upper pressure plate 2 of the molding machine, so that the molded resin material 1 is evenly distributed and compacted The encapsulation layer 4 is formed on the surface of the carrier board 3 after solidification, but the left and right movement of the molding resin material 1 will form a horizontal force F on the dies 5 arranged on the carrier board 3 according to a predetermined position, and the hot pressing The pressure of the molding process is very high, and in a high temperature environment, the viscosity of the adhesive tape 6 decreases, thereby reducing the bonding and positioning ability of the die 5, so the die 5 is easy to move under the pressure of the molding resin material 1 , deviate from the intended bonding position

[0004] Due to the occurrence of the offset phenomenon of the bare chip 5, it is difficult to locate the precise position of the bare chip 5 in the carrier 3 in the subsequent wiring process, which has a great impact on the wiring process, and even makes the wiring process difficult to carry out.

Images