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Flexible circuit board, laminating method and circuit board assembly

A flexible circuit board and assembly technology, applied in the direction of circuits, electrical components, fixed connections, etc., can solve the problems that affect the binding adhesion and electrical connection performance of flexible circuit boards, and are not easy to discharge, so as to ensure the binding adhesion and The effect of electrical connection performance

Active Publication Date: 2020-09-15
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a flexible circuit board, a pressing method and a circuit board assembly for the problems that the conductive adhesive is easy to form bubbles and is not easy to discharge, which affects the binding adhesion and electrical connection performance of the flexible circuit board.

Method used

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  • Flexible circuit board, laminating method and circuit board assembly
  • Flexible circuit board, laminating method and circuit board assembly
  • Flexible circuit board, laminating method and circuit board assembly

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Embodiment Construction

[0034] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0035] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected ...

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Abstract

The invention relates to a flexible circuit board, a laminating method and a circuit board assembly. The flexible circuit board comprises a main body part and a binding part, wherein the binding partcomprises a first area and a second area, the second area is arranged between the first area and the main body part, the binding part forms a boundary line at the connection position of the first areaand the second area, the binding part is provided with an exhaust hole penetrating through the first area, the binding part is provided with a plurality of wiring contacts arranged at intervals on the same side of the second area, and the wiring contacts extend to the boundary line. When a conductive adhesive is pressed, gas in the conductive adhesive can be exhausted from the exhaust hole alongthe gap (the gap between two adjacent wiring contacts) between the electrodes, and the gas in the conductive adhesive is easier to discharge, so that residual bubbles in the conductive adhesive are greatly reduced, and the binding adhesive force and the electrical connection performance of the flexible circuit board on a to-be-laminated panel are ensured.

Description

technical field [0001] The invention relates to the technical field of circuit binding, in particular to a flexible circuit board, a pressing method and a circuit board assembly. Background technique [0002] With the development of science and technology, modern people's demand and dependence on 3C products are increasing day by day. One machine needs to have multiple functions. In order to integrate many functions into the same product, the size of each component is bound to be reduced accordingly. For the binding area of ​​touch panels, display panels, and circuit boards waiting to be bound, when the size of the binding area is reduced, the alignment error between the binding area and the flexible circuit board is more obvious. In order to solve the above-mentioned problem of alignment error, the bonding area needs to be thermally bonded to the flexible circuit board through conductive glue. However, air bubbles are easy to form in the conductive adhesive and are not eas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/61H01R12/65
CPCH01R12/613H01R12/65
Inventor 洪诗雅
Owner INTERFACE TECH CHENGDU CO LTD
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