Method for encapsulating a microelectronic device, comprising a step of thinning the substrate and/or the encapsulation cover
一种微电子器件、封装盖的技术，应用在用于产生装饰表面效果的工艺、半导体/固态器件零部件、电气元件等方向，能够解决制造成本生产时间增加、复杂等问题
Active Publication Date: 2020-09-15
COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
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Problems solved by technology
However, this solution requires the rather complicated step of separating the thin substrate from its rigid support at the end of the method, for example, by inserting a blade between the substrate and the temporary support or by applying shear or pull
Furthermore, some temporary bonding schemes are not suitable for microelectronic devices whose methods require a thermal budget for temperatures above 300 °C
Finally, this bonding and separation step results in an increase in manufacturing cost and / or production time
Method used
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[0043] A method for encapsulating at least one microelectronic device, eg sensitive to air (to oxygen and water vapour), with an encapsulation lid will now be described. The method includes the following sequential steps:
[0044] a) Provide a support substrate 200 made of a first material comprising: a first main surface 201 on which a microelectronic device 300 is arranged, and a second main surface 202 opposite to the first main surface 201 .
[0045] b) Depositing an adhesive layer 500 made of a second material on the first side 201 of the support substrate 200 surrounding the microelectronic device 300 .
[0046] c) Positioning an encapsulation cover 400 made of a third material, comprising a first main face 401 and a second main face 402 opposite to the first main face 401, on the adhesive layer 500, so that the first part of the encapsulation cover 400 The main surface 401 is attached to the carrier substrate 200 and serves to encapsulate the microelectronic component...
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Abstract
The present invention concerns a method for encapsulating a microelectronic device (300), arranged on a support substrate (200), with an encapsulation cover (400) comprising, inter alia, the followingsequence of steps: a) providing a support substrate (200) on which a microelectronic device (300) is arranged, b) depositing a bonding layer (500) on the first face (201) of the substrate (200), around the microelectronic device (300), c) positioning an encapsulation cover (400) on the bonding layer (500) in such a way as to encapsulate the microelectronic device (300), and d) thinning the secondmain face (202) of the support substrate (200) and the second main face (402) of the encapsulation cover (400) by chemical etching.
Description
technical field [0001] The invention relates to a method for encapsulating a microelectronic component arranged on a support substrate with an encapsulation cover, the method comprising the step of thinning the support substrate and / or the encapsulation cover. [0002] The invention also relates to a microelectronic structure obtained by this method. Background technique [0003] In recent years, microelectronic components, especially all-solid thin-layer microbatteries, have become crucial in the development of airborne intelligent systems. For example, these smart systems are used in the so-called Internet of Things, energy storage, energy recovery, organic and inorganic electronics, or even applications in the field of electricity. [0004] The development of these intelligent systems will lead to the miniaturization of microelectronic components and their use in parallel with thinner and thinner supporting substrates. Substrates for these systems must be thin (typicall...
Claims
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IPC IPC(8): B81C1/00
CPCB81C1/00269B81C2203/0118B81C2203/019B81C2203/037Y02P70/50Y02E60/10H01L23/298
Inventor M·贝德加维R·萨洛
Owner COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES