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Laser punching equipment

A laser drilling and equipment technology, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of poor MARK point marking, low manual operation efficiency, and high labor cost, and achieve high equipment operation consistency and improved Consistency and accuracy in handling, labor cost saving effects

Pending Publication Date: 2020-09-22
厦门柔性电子研究院有限公司 +2
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the main way to deal with the MARK points of defective products is to manually paint black marks on the MARK points with an oil-based pen. The main problem of manual operation is that the MARK points of defective products are poorly marked or missing marks, so that defective products that should not be affixed with components Affixing components leads to waste of components; manual marking is wrong, and the MARK points of good products are marked, resulting in scrapping of good products without components; manual operation is inefficient, more labor-intensive, and high labor costs

Method used

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Embodiment Construction

[0037] In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.

[0038]In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " Vertical", "horizontal", "top", "bottom", "inner", "outer" and other indication orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying Describes, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and operate in a specific orientation, and therefore should not be construed as limiting the invention. In the description of the present invention, unless otherwise specified, "plurality" means two or ...

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Abstract

The invention discloses a laser punching equipment. The laser punching equipment comprises a machine frame, a laser punching mechanism, a lifting platform mechanism, a material transfer mechanism andan upper camera. The laser punching mechanism comprises a laser workbench, a mobile module, a laser device and a camera module. The lifting platform mechanism is arranged on a machine frame workbench.The material transfer mechanism comprises a robot and a suction disk jig. A robot is arranged on the machine frame workbench. The suction disk jig is arranged at the bottom end of a rotary arm of therobot. The upper camera is arranged on the part, corresponding to the upper part of the lifting platform, of the machine frame and is used to recognize materials on a lifting platform. With the laserpunching equipment, the operational accuracy and the production efficiency can be improved, equipment operation is automatic, one person can operate multiple devices, the human cost is reduced, and intelligent manufacturing can be implemented.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board production equipment, in particular to laser drilling equipment. Background technique [0002] Before SMT, the flexible circuit board needs to process the MARK points of the defective products marked with the defective product logo on the circuit board. During SMT, the components are not attached to the defective products, and the cost of components is saved. At present, the main way to deal with the MARK points of defective products is to manually paint black marks on the MARK points with an oil-based pen. The main problem of manual operation is that the MARK points of defective products are poorly marked or missing marks, so that defective products that should not be affixed with components Attaching components leads to waste of components; manual marking is wrong, and the MARK points of good products are marked, resulting in scrapping of good products without components; manual o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/70B23K26/382B23K101/42
CPCB23K26/382B23K26/702B23K2101/42
Inventor 赵继伟龚江华包克兵王一颖陈妙芳
Owner 厦门柔性电子研究院有限公司
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