Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate and a first metal wiring layer arranged on the substrate; a protective layer and an SOG flat layer are arranged on the face, away from the substrate, of the first metal wiring layer; a stepped hole is formed in the SOG flat layer; a plurality of via holesare formed in the stepped hole; each via hole extends to the first metal wiring layer; a packaging layer is arranged between a cover plate and the substrate; and the packaging layer covers part of the via holes. According to the display panel, the display device and the preparation method of the display panel provided by the embodiments of the invention, the SOG flat layer is etched and punched twice, a part of the SOG flat layer material is selectively removed at first, and then, the SOG flat layer material and a protective film which are left in the via holes are removed by arranging the via holes in a designated area, so that the situation of over etching of the protective layer and the situation of the retaining of the SOG material are avoided when the SOG material is removed, the display panel is packaged more effectively, and the reliability of packaging is improved.

Description

technical field [0001] The present invention generally relates to the field of display technology, and in particular to a display panel, a display device and a method for preparing a display panel. Background technique [0002] In the whole display system, the general technology of OLED products is to excite the spectrum of various wavelengths through the direct recombination of electrons and holes, thereby forming graphics. The display device formed by the OLED technology has a fast response speed and can maximize the contrast ratio at the same time, so the OLED display device is expected to become the mainstream display product of the next generation. At the same time, the top launch architecture is more suitable for high PPI products, adapting to market trends and industry trends. Therefore, the optimization design related to the top-emitting pixel architecture is particularly important. [0003] The solution process requires high flatness. At present, SOG layer (Siloxa...

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Problems solved by technology

[0003]The solution process requires high flatness. At present, SOG layer (Siloxane organic, organosiloxane) is used as the flat layer, but the process needs to be formed by dry etching process , there is an over-engraving problem when dry engraving a large area

Therefore, at present, the over-etching phenomenon is avoided by reducing the SOG etching time, but it also causes some SOG residues. SOG residues between the metal lines make the package failure faster, and the SOG etching area has a slower failure rate.

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