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Wafer cleaning device

A technology for cleaning wafers and cleaning tanks, applied in cleaning methods and appliances, cleaning methods using liquids, electrical components, etc., can solve problems such as cost sensing and correction, lower production efficiency, and leakage of cleaning solutions to ensure safety , the effect of improving production efficiency

Active Publication Date: 2020-09-25
LG SILTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, according to the related art, the leakage of the cleaning solution can be sensed only in the pipe connected to the cleaning tank, and the cleaning solution often leaks from the external tank due to aging or degradation, but there is a problem that since the cleaning solution passes through the external tank Leaks to the outside, so it is difficult to ensure safety
[0009] Also, when the cleaning solution leaks from the side of the external tank, the cleaning process is stopped, and then the leaking part is sensed visually and the leaking part is welded, but there is a problem that since not only the process is stopped, but also it takes a long time to Sensing and correcting leaky parts, thus reducing productivity

Method used

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Embodiment Construction

[0030] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, the scope of the spirit of the present invention can be determined from the matters disclosed in the embodiments, and the spirit of the embodiments of the present invention includes actual modifications to the embodiments presented below, such as addition, deletion, modification, etc. of components.

[0031] figure 1 and figure 2 are a front view and a side view showing a wafer cleaning apparatus according to the present invention.

[0032] In the wafer cleaning device according to the present invention, such as figure 1 and figure 2 As shown, the cleaning tank 110 and the four lifting parts 121, 122, 123 and 124 are arranged in the external water tank 130, the tray 150 for collecting and discharging the cleaning solution is arranged in the external water tank 130, and provides a The cleaning solution is guided to the first guide part 160 and the second guide...

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Abstract

The present invention relates to a wafer cleaning device which can prevent a cleaning solution from leaking and enables prompt treatment. The present invention provides a wafer cleaning device comprising: a cleaning bath which receives a cleaning solution and from which the cleaning solution overflows according to the dipping of wafers; a plurality of lift parts arranged at the outside of the cleaning bath and dipping the cassette into the cleaning solution in the cleaning bath; an external water tank having the cleaning bath and the lift parts received therein and including a drain hole through which the cleaning solution is drained; and a tray which can be detachably attached to the inner bottom surface of the external water tank and collects the cleaning solution to guide same to the drain hole.

Description

technical field [0001] The present invention relates to a wafer cleaning device capable of preventing cleaning solution from leaking to the outside and responding quickly thereto. Background technique [0002] In general, silicon wafers are manufactured through the following processes: a growth process for growing polycrystalline silicon into single crystal silicon ingots, a slicing process for cutting the grown single crystal silicon ingots into wafer shapes, A grinding process for uniformizing and planarizing the thickness of a wafer, an etching process for removing or mitigating damage caused by mechanical polishing, a polishing process for mirror-polishing the surface of a wafer, and a cleaning process for cleaning a wafer. [0003] Generally, a wafer cleaning device is used to perform a cleaning process, and when a cleaning solution of a strong alkaline solution is contained in the internal tank and the cleaning solution overflows from the internal tank, the wafer movin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCB08B3/048H01L21/67057H01L21/68742H01L21/67757H01L21/6715B08B3/08H01L21/67326
Inventor 河世根
Owner LG SILTRON
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