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Chip, chip packaging method, and electronic device

A chip and chip body technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problem of high packaging cost

Active Publication Date: 2021-01-29
SHENZHEN GOODIX TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a chip, a chip packaging method, and electronic equipment to solve the problem of high packaging cost caused by the packaging method of the existing chip using a ceramic substrate

Method used

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  • Chip, chip packaging method, and electronic device
  • Chip, chip packaging method, and electronic device
  • Chip, chip packaging method, and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] figure 1 A schematic top view structure of a chip provided in this embodiment, which shows a top view of the chip, figure 2 for figure 1 A schematic cross-sectional view along line A-A.

[0095] A chip 10 provided in the embodiment of the present application includes a chip body 11, a lead frame 12 and a resin support 13, specifically, as figure 1 and figure 2 As shown, the resin support 13 can at least include two opposite ends (such as the bottom and the top), the lead frame 12 is fixed on one end of the resin support 13 (such as the bottom of the resin support 13), and the resin support 13 surrounds Set on the lead frame 12, the resin bracket 13 and the lead frame 12 jointly enclose the housing cavity 14, specifically, the lead frame 12 forms the bottom surface of the housing cavity 14, the resin bracket 13 forms the side wall of the housing cavity 14, and the resin bracket 13 has a first opening 136 on the other end opposite to the lead frame 12, and the first...

Embodiment 2

[0163] Figure 13 It is a schematic diagram of the structure of the chip provided by this embodiment along the line A-A.

[0164] see Figure 13 As shown, the chip 10 provided by the embodiment of the present application is different from the first embodiment in that the first support part 131 is molded on the lead frame 12 by mold hot pressing, and the second support part 132 is separately formed.

[0165] Figure 14 It is a schematic diagram of the front structure of the lead frame used in the chip provided by this embodiment and the first support part of the resin support after molding, Figure 15 yes Figure 14 A schematic sectional view along line A-A, Figure 16 yes Figure 14 A schematic sectional view along line B-B.

[0166] see Figure 14 to Figure 16 As shown, specifically, the first support part 131 is formed on the outer peripheral side wall of the lead frame through the first mold, and the filling part 133 is formed in the insulating gap between two adjace...

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Abstract

The invention provides a chip, a chip packaging method, and electronic equipment. The chip includes a chip body, a lead frame and a resin support. The lead frame is fixed on one end of the resin support, and the support is surrounded by the lead frame. The frame and the resin support form an accommodating cavity. The chip body is located in the accommodating cavity, and the lead frame includes a first metal plate area and a second metal plate area that are insulated from each other, the chip body is arranged on the first metal plate area, and the chip body is electrically connected to the second metal plate area, that is, through The resin bracket and the lead frame realize the packaging of the chip body. The cost of the resin material is relatively low, and the process method of forming the resin bracket through the resin is relatively simple, which improves the production efficiency and helps to reduce the production cost, thus effectively reducing the cost of the chip and solving the problem of packaging the existing chip with a ceramic substrate. way, leading to the problem of high cost of chip packaging.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a chip, a chip packaging method, and electronic equipment. Background technique [0002] 3D imaging can record the distance information between the shooting target object and the camera, and obtain the three-dimensional coordinate information of the shooting target object by modeling the static or dynamic three-dimensional coordinate information of the shooting target object. Therefore, 3D imaging has great application potential in physical recognition, action recognition, scene recognition, etc. Among them, as a technical branch of 3D imaging, the active vision system is an imaging technology that uses an independent artificial light source to actively project to the observed object to measure the depth of field, such as structured light 3D and TOF. Due to the advanced nature of the system technology, it has been widely used in terminal equipment. [0003] At ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/14H01L23/495H01L21/50H01L25/16
CPCH01L21/50H01L23/145H01L23/49541H01L23/49568H01L25/167H01L2224/48247H01L2224/49175
Inventor 王超宏
Owner SHENZHEN GOODIX TECH CO LTD