Unlock instant, AI-driven research and patent intelligence for your innovation.

A docking device for the guide plate mems probe structure and the transfer layer

A docking device and guide plate technology, which is applied in the direction of measuring devices, electrical measuring instrument parts, instruments, etc., can solve problems such as unrealizable, bent probes, and production failures, and achieve the effect of manufacturing

Active Publication Date: 2020-12-25
MAXONE SEMICON CO LTD
View PDF18 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0038] Among these technologies, some are used to manufacture larger-sized probe cards, and some are used to avoid burning needles during the test process. Although there are also technologies for manufacturing more integrated probe cards, they still cannot achieve the probe size. Fabrication of Probe Cards at the Submicron Level
The reason is that for probes with sub-micron size, it is impossible to effectively avoid probe bending during the manufacturing process. Once the probe is slightly bent, it will contact another probe with only a sub-micron distance, resulting in Production failed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A docking device for the guide plate mems probe structure and the transfer layer
  • A docking device for the guide plate mems probe structure and the transfer layer
  • A docking device for the guide plate mems probe structure and the transfer layer

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0062] The following is an embodiment of a MEMS probe card.

[0063] The structure diagram of the MEMS probe card under this embodiment is as follows figure 1 As shown, the MEMS probe card includes a reinforcement member 1, a PCB board 2, an adapter layer 3, a guide plate 4, and a MEMS probe 5 from top to bottom; the reinforcement member 1 is used to increase the strength of the MEMS probe card , the PCB board 2 is used to connect the testing machine and signal routing, the transfer layer 3 is the medium between the PCB board 2 and the MEMS probe 5, and is used to realize the fixed transfer of signals, and the guide board 4 is used for For accommodating MEMS probes 5, the MEMS probes 5 are used to connect the wafer under test to realize the test of the electrical properties of the wafer;

[0064] The guide plate 4 and the MEMS probe 5 jointly form a guide plate MEMS probe structure, and the guide plate MEMS probe structure is made by using a guide plate MEMS probe structure t...

specific Embodiment approach 2

[0066] The following is the embodiment of the template burning device for the guide plate MEMS probe structure.

[0067] The guide plate MEMS probe structure template burning equipment under this embodiment, the structure schematic diagram is as follows figure 2 As shown, the guide plate MEMS probe structure template burning equipment is sequentially provided with a light source 7-1, a pinhole 7-2, a collimating mirror 7-3, an x-direction slit expansion plate 7-4, y-direction slit expansion plate 7-5, first prism 7-6, plane mirror 7-7, second prism 7-8, first image sensor 7-9, controller 7-10 and laser array 7-11 ;

[0068] The light beam emitted by the light source 7-1 passes through the pinhole 7-2 to form a point light source, the pinhole 7-2 is located at the focal point of the collimating mirror 7-3, and the point light source passes through the collimating mirror 7-3 to form parallel light, The parallel light passes through the x-direction slit expansion plate 7-4 to ...

specific Embodiment approach 3

[0070] The following is the embodiment of the template burning device for the guide plate MEMS probe structure.

[0071] The guide plate MEMS probe structure template burning equipment under this embodiment, the structure schematic diagram is as follows figure 2 As shown, the guide plate MEMS probe structure template burning equipment is further defined on the basis of the second embodiment:

[0072] The x-direction slit expansion plate 7-4 and the y-direction slit expansion plate 7-5 are placed vertically, and both the x-direction slit expansion plate 7-4 and the y-direction slit expansion plate 7-5 include coaxial step rollers 7 -45-1, pull wire 7-45-2 and slit plate 7-45-3, the coaxial ladder roll 7-45-1, such as image 3 shown;

[0073] The coaxial stepped roller 7-45-1 includes coaxially arranged rollers with different diameters, the diameters of the rollers are arranged from small to large, which is an arithmetic sequence, and the first item is twice the tolerance, an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a docking device for a guide plate MEMS probe structure and an adapter layer, which belongs to the technical field of IC manufacturing industry, and specifically relates to micro-electromechanical system manufacturing, semiconductor bare core testing and related key technologies; the device includes a third prism, an imaging objective lens, The second image sensor, lifting platform, bracket, cylinder, support plate and two-dimensional translation platform; the present invention not only discloses a docking device between the guide plate MEMS probe structure and the transfer layer, but also discloses a MEMS probe The new manufacturing process of the card, from the structure of the MEMS probe card, to the burning equipment and method of the guide board MEMS probe structure template, the probe positioning method for the guide board MEMS probe structure template burning, and then to the guide board The manufacturing method of the board MEMS probe structure, finally to the docking device and method of the guide board MEMS probe structure and the transfer layer, finally realizing the manufacture of the sub-micron MEMS probe card.

Description

technical field [0001] The invention relates to a docking device for a guide plate MEMS probe structure and an adapter layer, which belongs to the technical field of IC manufacturing industry, and specifically relates to micro-electromechanical system manufacturing, semiconductor bare core testing and related key technologies. Background technique [0002] The probe card is a very important technology in the chip manufacturing process. Before the chip is packaged, the probes on the probe card directly contact the pads or bumps on the chip to lead out the chip signal, and then cooperate with peripheral testing instruments and Software control realizes automatic measurement, and then screens out defective products to ensure product yield. [0003] With the development of micro-electromechanical systems (MEMS) technology, the volume of chips is getting smaller and smaller, reaching the order of millimeters, and the integration level inside the chip is getting higher and higher,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R3/00G01R31/28G01R1/073
CPCG01R1/07314G01R3/00G01R31/2886
Inventor 王艾琳赵梁玉
Owner MAXONE SEMICON CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com