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Inductive coupling reactor and working method thereof

A technology of inductive coupling and working method, which is applied in semiconductor/solid-state device manufacturing, discharge tubes, electrical components, etc., can solve problems such as difficult adjustments, and achieve the effect of strengthening control capabilities

Pending Publication Date: 2020-10-13
上海邦芯半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, in general, the plasma density distributed over the central region of the wafer is greater than that distributed over the edge region of the wafer, and this distribution is difficult to adjust

Method used

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  • Inductive coupling reactor and working method thereof
  • Inductive coupling reactor and working method thereof
  • Inductive coupling reactor and working method thereof

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Experimental program
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Embodiment Construction

[0026] As mentioned in the background, in the existing inductively coupled reactors, it is difficult to controllably adjust the distribution of the generated ions.

[0027] An inductively coupled reactor, reference figure 1 , including an inductively coupled radio frequency unit, the inductively coupled radio frequency unit includes a shielding cover 1000, a reaction chamber dielectric tube 1001 located inside the shielding cover 1000, a coil-shaped radio frequency antenna 1002 located on the side wall of the reaction chamber dielectric tube 1001, the The shape of the reaction chamber dielectric pipe 1001 is columnar, and the coil-shaped radio frequency antenna 1002 surrounds the reaction chamber dielectric pipe 1001 , and the position of the coil-shaped radio frequency antenna 1002 is fixed.

[0028] In the above-mentioned inductively coupled reactor, the gas is passed into the reaction chamber medium pipe 1001 from the inlet pipe 1003 at the top of the reaction chamber mediu...

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Abstract

The invention discloses an inductive coupling reactor and a working method thereof. The inductive coupling reactor comprises a reaction cavity main body and an inductive coupling radio frequency unitpositioned above the reaction cavity main body; the inductive coupling radio frequency unit comprises a shielding case, a reaction chamber medium pipe located in the shielding case and radio frequencyantennas; the side wall of the reaction chamber medium pipe is inclined, and the top cross section of the reaction chamber medium pipe is smaller than the bottom cross section of the reaction chambermedium pipe; and the radio frequency antennas are located in the shielding case and distributed at the side part of the reaction chamber medium pipe; the radio frequency antennas comprise effective radio frequency antennas; and the heights of the effective radio frequency antennas are adjustable. The inductive coupling reactor can enhance the control capability of plasma distribution.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an inductively coupled reactor and a working method thereof. Background technique [0002] In semiconductor manufacturing, multiple processes are involved, and each process is completed by certain equipment and processes. Among them, the etching process is an important process in semiconductor manufacturing, such as a plasma etching process. The plasma etching process uses the reactive gas to generate plasma after obtaining energy, which contains charged particles such as ions and electrons and highly chemically active neutral atoms, molecules and free radicals, and performs physical and chemical reactions on the etching object. etch. [0003] However, during the plasma etching process, the etching conditions at the edge of the wafer are quite different from those at the center of the wafer. The etching conditions include: plasma density distribution, radio frequency ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01J37/32
CPCH01J37/321H01J37/3211H01J37/32651H01J2237/327H01J2237/334H01L21/67069
Inventor 吴堃杨猛
Owner 上海邦芯半导体科技有限公司