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Chip assembly, chip packaging structure and electronic equipment

A technology of chip packaging structure and electronic equipment, applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve problems such as wire bonding, gold wire touching the shell, failure, product performance degradation, etc., to avoid the instability of gold wire pulling Effect

Active Publication Date: 2020-10-16
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

In the prior art, silica gel is often used to bond the two chips together, but due to the soft texture of silica gel, in the subsequent wire bonding process (Wire Bonding), it is easy to cause the gold wire to be unstable, resulting in wire Floating, overlapping wires, gold wires touching the shell, etc., will lead to product performance degradation or even failure

Method used

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  • Chip assembly, chip packaging structure and electronic equipment
  • Chip assembly, chip packaging structure and electronic equipment

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Embodiment Construction

[0020] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0021] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0022] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0023] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a chip assembly, a chip packaging structure and electronic equipment. The chip assembly comprises a first chip and a second chip, and the first chip is provided with a first surface and a second surface which are arranged oppositely; the second chip comprises a body part and a connecting part, and the connecting part is connected to the first surface of the first chip; thebody part is connected with the connecting part, and a gap is formed between the body part and the first chip; the connecting part is provided with an electric connecting piece, and the body parts ofthe first chip and the second chip are connected and conducted with the electric connecting piece.

Description

technical field [0001] The present invention relates to the technical field of semiconductor packaging, and more specifically, to a chip component, a chip packaging structure and electronic equipment. Background technique [0002] In recent years, with the rapid development of the electronics industry, electronic packaging has gradually become an important direction of industry development. As consumer electronics products tend to be miniaturized, packaging technology has become a hot topic. Flip Chip plays an important role in today's chip packaging. Flip Chip packaging technology has many obvious advantages compared with traditional wire bonding processes, such as superior electrical and thermal properties, high I / O pin count, packaging size reduction etc. In order to move towards higher performance, chip packaging has adopted the Flip Chip packaging method on a large scale. Shorter contact connections lead to smaller parasitic capacitance and smaller packaging volume. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/18H01L23/535H01L23/31
CPCH01L25/18H01L23/535H01L23/3107
Inventor 于文秀付博
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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