A preparation method of copper-aluminum layered composite material with effective control of interfacial reaction

A layered composite material and interface control technology, applied in the direction of metal layered products, chemical instruments and methods, coatings, etc., can solve the problem that the uniformity of product performance is difficult to be guaranteed, affect the thermal conductivity and electrical conductivity of materials, and the rolling and compounding process Complicated and other issues, to achieve a good interface combination effect, to realize the integrated design of structure and function, and to achieve the effect of simple and easy production process

Active Publication Date: 2021-06-25
NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The rolling composite process is complex and the uniformity of product performance is difficult to guarantee; explosive welding is more serious to environmental pollution, and there are relatively large safety hazards; surface deposition is formed by diffusion deposition in the form of atomic or molecular scale, which is slow in preparation and expensive. High, generally not suitable for the manufacture of large structural parts
[0004] In addition, the interface is an important factor affecting the performance of composite materials. The interface bonding of copper-aluminum layered composites can be improved by heat treatment. However, in the Cu-Al binary system, heat treatment can easily make the material form intermetallic compounds at the interface. layer, which affects the thermal and electrical conductivity of the material

Method used

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  • A preparation method of copper-aluminum layered composite material with effective control of interfacial reaction
  • A preparation method of copper-aluminum layered composite material with effective control of interfacial reaction

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Experimental program
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Embodiment 1

[0027] This embodiment includes the following steps:

[0028] Step 1. Place the Al foil with a size of 50mm×50mm×0.1mm (length×width×thickness) in a NaOH solution with a mass concentration of 5% for 5 seconds, and dry it after neutralization to complete the surface pretreatment, and then carry out GO / Al foil is obtained by electrophoretic deposition of graphene oxide, and then placed in a vacuum drying oven for drying treatment; the electrophoretic deposition solution used in the electrophoretic deposition contains GO and Al(NO 3 ) 3 C 2 h 5 OH solution, the content of GO in the electrophoretic deposition solution is 0.75g / L, Al(NO 3 ) 3 The content is 0.25g / L, the voltage used for electrophoretic deposition is 120V, and the electrophoretic deposition time is 20s;

[0029] Step 2: Place the Cu foil with a size of 50mm×50mm×0.04mm (length×width×thickness) in an HCl solution with a mass concentration of 5% for cleaning for 5 seconds, and dry it after neutralization treatmen...

Embodiment 2

[0042] This embodiment includes the following steps:

[0043] Step 1. Place the Al foil with a size of 50mm×50mm×0.1mm (length×width×thickness) in a NaOH solution with a mass concentration of 5% for 10 seconds, and then dry it after neutralization to complete the surface pretreatment, and then carry out GO / Al foil is obtained by electrophoretic deposition of graphene oxide, and then placed in a vacuum drying oven for drying treatment; the electrophoretic deposition solution used in the electrophoretic deposition contains GO and Al(NO 3 ) 3 C 2 h 5 OH solution, the content of GO in the electrophoretic deposition solution is 1.25g / L, Al(NO 3 ) 3 The content is 0.5g / L, the voltage used for electrophoretic deposition is 100V, and the electrophoretic deposition time is 60s;

[0044] Step 2: Place the Cu foil with a size of 50mm×50mm×0.1mm (length×width×thickness) in an HCl solution with a mass concentration of 5% for 10 seconds, and then dry it after neutralization treatment t...

Embodiment 3

[0048] This embodiment includes the following steps:

[0049] Step 1. Place the Al foil with a size of 50mm×50mm×0.1mm (length×width×thickness) in a NaOH solution with a mass concentration of 5% for 7 seconds, and then dry it after neutralization treatment to complete the surface pretreatment, and then carry out GO / Al foil is obtained by electrophoretic deposition of graphene oxide, and then placed in a vacuum drying oven for drying treatment; the electrophoretic deposition solution used in the electrophoretic deposition contains GO and Al(NO 3 ) 3 C 2 h 5 OH solution, the content of GO in the electrophoretic deposition solution is 0.5g / L, Al(NO 3 ) 3 content of 0.125g / L, the voltage used for electrophoretic deposition is 150V, and the time of electrophoretic deposition is 10s;

[0050] Step 2. Place the Cu foil with a size of 50mm×50mm×0.04mm (length×width×thickness) in an HCl solution with a mass concentration of 5% for cleaning for 7 seconds, and dry it after neutraliz...

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Abstract

The invention discloses a method for preparing a copper-aluminum layered composite material that effectively controls interfacial reactions. The method includes: 1. preparing GO / Al foil; 2. combining the dried GO / Al foil with the surface pretreated Cu-GO / Al preforms are obtained by stacking Cu foils alternately along the direction of the flat layer; 3. Pressurizing the Cu-GO / Al preforms and then heating and maintaining the pressure; 4. Cooling and depressurizing to obtain a copper-aluminum layered composite Material. In the present invention, the GO / Al foil with GO deposited on the surface and the Cu foil are stacked and then pressed by heating and pressing, and the GO between the Cu foil and the Al foil is used to avoid the reaction between Cu and Al at the interface to form an intermetallic foil. The compound improves the Cu-Al interface reaction bonding in the copper-aluminum layered composite material, and at the same time ensures the thermal conductivity and electrical conductivity of the copper-aluminum layered composite material, and realizes the integrated design of the structure and function of the copper-aluminum layered composite material.

Description

technical field [0001] The invention belongs to the technical field of sheet metal preparation of layered metal composite materials, and in particular relates to a method for preparing copper-aluminum layered composite materials that effectively controls interface reactions. Background technique [0002] The reality of scarce resources puts forward higher requirements for modern new materials, that is, to realize the integration of structure and function of materials, especially in the field of energy, this demand is particularly urgent. Cu and its alloys are widely used as thermal and electrical conductive structural parts due to their excellent thermal conductivity, electrical conductivity and mechanical properties. However, Cu itself is relatively insufficient in resources, and its price is relatively high. In addition, Cu has a high density and tends to be heavy as a member. Therefore, it is of great engineering significance to seek substitutes for Cu and its alloys. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/06B32B37/10B32B15/01B32B15/20C25D13/02
CPCB32B15/017B32B15/20B32B37/06B32B37/10C25D13/02
Inventor 杜岩雷诚心霍望图樊科社沈春豫吴昊董龙龙张伟
Owner NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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