Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

System-on-chip and intelligent wearable device

A smart wearable device and system-on-a-chip technology, applied in the field of chips, can solve problems such as low power consumption, multi-function and PCB layout.

Pending Publication Date: 2020-10-23
SPREADTRUM COMM (SHANGHAI) CO LTD
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a system-level chip and intelligent wearable

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • System-on-chip and intelligent wearable device
  • System-on-chip and intelligent wearable device
  • System-on-chip and intelligent wearable device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] This embodiment provides a system-on-a-chip, such as figure 1 As shown, it includes power management chip, RAM, main control subsystem, sub-control subsystem and multiple functional subsystems.

[0029] The main control subsystem, the secondary control subsystem and the functional subsystem all include an MCU. like figure 1 As shown, the main control subsystem includes MCU-main control, the sub-control subsystem includes MCU-sub-control, functional subsystem 1 includes MCU-1, functional subsystem 2 includes MCU-2, and functional subsystem N includes MCU-N. Among them, each subsystem can be switched between the working mode and the sleep mode, so as to achieve the purpose of low power consumption and power saving.

[0030] MCU is also called single chip microcomputer (Single Chip Microcomputer) or single chip microcomputer. Integrate on a single chip to form a chip-level computer, and do different combination controls for different applications. The MCU in this embod...

Embodiment 2

[0050] This embodiment provides a smart wearable device, such as Figure 4 As shown, it includes a touch screen, a plurality of sensors, and the system-on-a-chip described in Embodiment 1, and the touch screen and the sensors are respectively electrically connected to the system-on-a-chip. In this embodiment, the user can operate the content displayed on the smart wearable device through the touch screen, and the smart wearable device makes different responses based on different operations of the user.

[0051] Due to the use of the system-on-a-chip provided in Embodiment 1, the smart wearable device provided in this embodiment has the advantages of rich functional applications, low power consumption, and low cost.

[0052] In some optional implementation manners, the aforementioned sensors include a heart rate sensor, an acceleration sensor, a gyroscope sensor, and the like. Among them, the auxiliary control subsystem in the system-level chip is used to realize the functions...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a system-on-chip and an intelligent wearable device. The system-on-chip comprises a power source management chip, an RAM, a main control subsystem, an auxiliary control subsystem and a plurality of function subsystems; the main control subsystem, the auxiliary control subsystem and the function subsystems each comprise an MCU; the main control subsystem, the auxiliary control subsystem and the function subsystems are connected with the RAM through a bus; the power source management chip is used for supplying power to the RAM, the main control subsystem, the auxiliary control subsystem and the plurality of functional subsystems. According to the system-on-chip and the intelligent wearable device of the invention, the power source management chip, the RAM, the main control subsystem, the auxiliary control subsystem and the plurality of functional subsystems are integrated into one system-on-chip; compared with the prior art that multiple chips are used for achieving the same function, the system-on-chip can reduce power consumption and cost and effectively reduce space needed by PCB layout, and therefore, providing a solution which is rich in function application, low in power consumption, not limited by PCB layout and low in cost for the intelligent wearable device.

Description

technical field [0001] The present invention relates to the field of chip technology, in particular to a system-on-chip (System on Chip, SoC) and a smart wearable device. Background technique [0002] Smart wearable device is a general term for the application of wearable technology to intelligently design daily wear and develop wearable devices, such as watches, bracelets, glasses, clothing, etc. Among them, smart watches are the most widely used type of smart wearable devices. [0003] For smart watches, an important feature is long standby and long battery life. Due to the limitation of physical size, all electronic components must be integrated into a dial with a diameter of about 40mm. If you want smart watches to integrate more functions, it will cause limitations in PCB layout and battery capacity. In addition, smart watches often cannot be loaded with large-capacity batteries. At the same time, due to the convenience of wearing them, users often expect smart watche...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F15/78
CPCG06F15/7803Y02D10/00
Inventor 饶国明张慧敏肖正飞陈波
Owner SPREADTRUM COMM (SHANGHAI) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com