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Waterproof pressure sensor and packaging method

A technology of pressure sensor, packaging method, applied in the direction of instrument, measuring force, measuring device, etc.

Pending Publication Date: 2020-10-23
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a waterproof pressure sensor and a packaging method, aiming to improve the problem that the current waterproof pressure sensor is difficult to detect whether the glue thickness is within a reasonable range

Method used

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0034] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0035] In addition, in t...

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Abstract

The invention discloses a waterproof pressure sensor and a packaging method, and the sensor comprises a circuit board, a shell, a chip and a waterproof glue layer. The shell is installed on the circuit board, a containing space is defined by the shell and the circuit board, and a dispensing opening is formed in the shell; the chip is arranged on the circuit board and is positioned in the containing space; and the waterproof glue layer is filled in the containing space and covers the chip, and the waterproof glue layer comprises transparent solid glue and insoluble opaque particles filled in the transparent solid glue. A CCD visual detection system or a common optical microscope can be adopted to observe the proportion of the opaque particles, and then the proportion of the opaque particlesis compared with the proportion of the opaque particles in the standard glue thickness, so that whether the thickness of the waterproof glue layer is within a reasonable range or not is detected.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a waterproof pressure sensor and a packaging method. Background technique [0002] With the development of science and technology, pressure sensors are more and more widely used in consumer electronics. There are more and more applications for mobile phone navigation, drone height determination, health monitoring (lung capacity measurement), and more and more application scenarios. , Consumers have higher and higher requirements for product performance, which puts forward higher requirements for the waterproof performance of products. For pressure sensors, in order to achieve high waterproof level and waterproof reliability, covering the chip with elastic glue is a simple and practical method that can not only achieve waterproof performance but also effectively protect the chip. [0003] The color of the glue covering the chip is very particular. Among them, transparent co...

Claims

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Application Information

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IPC IPC(8): H01L23/29H01L21/56G01L1/00G01B11/06
CPCH01L23/29H01L21/56G01L1/005G01B11/0616H01L2224/73265H01L2224/48091H01L2924/00014
Inventor 王超李向光付博方华斌
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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