Air bubble film winding device for electronic product packaging

Abstract

The invention relates to a bubble film winding device for electronic product packaging, which belongs to the technical field of packaging equipment and includes a base on which a fixing plate is fixedly installed. A slidable support plate, a baffle is fixedly installed on the top of the support plate, a rotating rod connected to it is installed in the baffle, one end of the rotating rod is fixedly installed with a splint, the other end runs through the fixed plate and is screwed to it, and one end of the support plate is installed with a The sliding plate is slidably connected with the sliding plate, and a rotating disk matching the splint is installed in the sliding plate, and a driving mechanism for driving the rotating rod is slidably installed on the fixed rod; the present invention performs directional movement while the electronic product is rotating and winding, In this way, the air bubble film is evenly rolled on the surface of the entire electronic product, which realizes uniform and efficient winding packaging of electronic products of different specifications, improves the packaging efficiency and packaging effect, has a good protective effect, and is more convenient and practical.

Description

technical field [0001] The invention relates to the technical field of packaging equipment, in particular to an air bubble film winding device for electronic product packaging. Background technique [0002] Packaging equipment refers to equipment that can complete all or part of the product and commodity packaging process. The packaging process includes main processes such as filling, wrapping, and sealing, as well as related pre- and post-processing processes, such as cleaning, stacking, and disassembly. In addition, packaging also includes processes such as measuring or stamping on the package. The use of mechanical packaging products can increase productivity, reduce labor intensity, meet the needs of large-scale production, and meet the requirements of cleanliness and sanitation. [0003] In order to protect electronic products, some electronic products are currently packaged with a certain thickness of air bubble film on its surface. The traditional air bubble film pa...

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Problems solved by technology

[0003] In order to protect electronic products, some electronic products are currently packaged with a certain thickness of air bubble film on its surface. The traditional air bubble film packaging is manually wound, which is inefficient and labor-intensive. However, the existing air bubble film on the market The structure of the film winding equipment is complex, and it can only wind the air bubble film for electronic products with specific specifications. When the length of the product is different, it cannot be fixed to realize the air bubble film winding. It is possible to fix products of different specifications, but the size of the bubble film is limited and cannot cover the entire surface of the product at one time, so multiple windings are required, which results in uneven winding and low winding efficiency. Therefore need to optimize

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