Telescopic equipment for leveling tile surfaces
A technology for ceramic tiles and equipment, applied in the field of decoration auxiliary equipment, can solve the problems of inconsistent depth of tile adhesive surfaces, reduce the frequency of use of rubber hammers, etc., to improve the effect of earthquake resistance and impact resistance, reduce the probability of tile breakage, and avoid downward displacement. Effect
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Embodiment 1
[0031] See attached Figure 1-9 As shown, the telescopic equipment for leveling the ceramic tile paste surface includes: telescopic assembly 10, the telescopic assembly 10 is arranged in a row and the tiles are laid on the telescopic assembly 10, the telescopic assembly 10 includes a vertically arranged support screw 50, the support screw 50 The bottom is threadedly connected with a connecting sleeve 53, the upper port of the connecting sleeve 53 is threadedly connected with the supporting screw 50, the upper end of the supporting screw 50 is connected with the lifting adjustment box 40, and the center of the upper part of the lifting adjusting box 40 is provided with a third hole 43 which is semi-through. The three-hole body 43 is internally threaded with a connection base 42, the bottom of the connection base 42 has a connection cylinder 423 threaded with the third hole body 43, and the side of the connection base 42 is provided with an auxiliary bump 424 for pushing the conn...
Embodiment 2
[0040] Using the method of using telescopic equipment for leveling the pasted surface of tiles, the steps are as follows:
[0041] -Clean and level the bottom surface of the paving, and then use a wire brush to roughen the bottom surface of the paving;
[0042] - Arrange the telescopic components 10 in a row on the ground, specifically in a rectangular row, and arrange the spacing according to the length and width of the tiles;
[0043] - Place the tiles on the upper part of the telescopic assembly 10 to keep the distance between the tiles and the ground. The tiles placed on the upper part of the telescopic assembly 10 are placed at intervals of 90°. A gap is reserved between the tiles. The gap between the reserved tiles is 1 mm. The thickness of the gap is the limit plug Plate 411 thickness;
[0044] -Placing a level on the top of the tiles, filling the bottom of the tiles with concrete;
[0045] - When the tiles are uneven, adjust the flatness of the tiles by rotating the ...
Embodiment 3
[0051] This embodiment is optimized as follows on the basis of Embodiment 1: the insertion slot 44 is a half-through slot, the height of the slot is greater than the thickness of the first connecting plate 20, and the difference between the two should be less than 1mm. The slotted hole 44 and the first connection plate 20 are connected in a plug-in manner, and of course it is not limited to this and can also be an adhesive method. The second strip 21 on the first connection plate 20 is a strip of rubber material. In order to improve the stability of the insertion, of course, the upper and lower groove walls in the insertion slot 44 can be provided with a strip corresponding to the second strip 21 to improve the stability of the insertion. Optionally, the first connecting plate 20 After plugging with the socket slot 44, glue is used to glue the socket to realize the fixed connection between the two.
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