A substrate processing device for semiconductor refrigeration sheet production

Abstract

The present invention relates to the technical field of semiconductor refrigerated sheet processing attachments, in particular to a substrate processing device for the production of semiconductor refrigerated sheets, which can simultaneously polish both sides of the ceramic sheet, thus improving the processing efficiency of the ceramic sheet and reducing the The two grinding surfaces of the tiles have a relatively high degree of parallelism; including the workbench and the grinding mechanism, four sets of legs are set at the bottom of the workbench; it also includes a fixed frame, a support plate, two sets of adjustment plates, and two sets of extruding plates. Pressure plate, two sets of cylinder assemblies, two sets of support plates, two sets of limit shafts, two sets of retaining rings, lifting handle and fixed plate, the lower left area of ​​the fixed frame is connected with the top left side of the workbench, and the top of the fixed plate Connected with the bottom of the upper right area of ​​the fixed frame, the grinding mechanism is provided with two groups of motor components, and the output ends of the two groups of motor components are equipped with grinding wheels, and the two groups of motor components are installed on the upper left area of ​​the fixed frame and the fixed plate respectively. At the left end, a card slot is arranged on the top of the support plate.

Description

technical field [0001] The invention relates to the technical field of auxiliary devices for processing semiconductor refrigerating chips, in particular to a substrate processing device for producing semiconductor refrigerating chips. Background technique [0002] As we all know, ceramic chips are an important part of semiconductor refrigeration chips. When processing ceramic chips, it is necessary to polish the ceramic chips to improve the quality of semiconductor cooling chips. The substrate processing device for semiconductor cooling chips is a kind of During the production and processing of refrigerating sheets, the device used to polish ceramic sheets has been widely used in the field of semiconductor refrigerating sheet production; the existing substrate processing device for refrigerating sheet production includes a workbench and a grinding mechanism , the bottom of the workbench is provided with four sets of legs, and the grinding mechanism is installed on the top of...

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Problems solved by technology

[0002] As we all know, ceramic chips are an important part of semiconductor refrigeration chips. When processing ceramic chips, it is necessary to polish the ceramic chips to improve the quality of semiconductor cooling chips. The substrate processing device for semiconductor cooling chips is a kind of During the production and processing of refrigerating sheets, the device used to polish ceramic sheets has been widely used in the field of semiconductor refrigerating sheet production; the existing substrate processing device for refrigerating sheet production includes a workbench and a grinding mechanism , the bottom of the workbench is provided with four sets of legs, and the grinding mechanism is installed on the top of the workbench; when the existing substrate processing device for semiconductor refrigeration chip production is used, the staff starts the grinding mechanism on the top of the workbench, and then the staff will The surface to be polished of the ceramic chip is polished close to the grinding mechanism, and then the other side of the ceramic chip can be polished; in the use of the existing substrate processing device for the production of semiconductor refrigeration chips, it is found that grinding the ceramic chip face by face is more efficient. At the same time, due to human factors, it is difficult to make the two polished surfaces of the ceramic tile have a high parallelism, resulting in poor practicability

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