A conductive adhesive coating nozzle for chip packaging
A technology of chip packaging and conductive adhesive, applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of poor distribution uniformity of conductive adhesive, uneven offset of conductive adhesive, low stability and reliability, etc., and achieve uniform distribution , good stability and performance, and the effect of improving stability and reliability
Active Publication Date: 2022-01-21
威海和祥泰数码科技有限公司
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Problems solved by technology
[0005] The invention provides a conductive adhesive coating nozzle for chip packaging, which is capable of uniformly coating the conductive adhesive, so that the conductive adhesive coated on the pad will not flow and migrate, and it can be used for bonding chips It has the advantages of high stability and reliability, and solves the problem that when the conductive glue is coated with a syringe or syringe, because the nozzle is a cylindrical cavity structure, the conductive glue that is squeezed and sprayed on the pad is raised The linear structure, and after the coating is completed, there will be a certain liquid flow phenomenon, which will cause the conductive adhesive coated on the pad to be unevenly shifted to both sides, which will cause the bottom of the chip when the chip is pressed The uniformity of the conductive adhesive distribution is poor, resulting in low stability and reliability of the chip when packaged and bonded, which seriously affects the performance of the chip.
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[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0021] see Figure 1-3 , a conductive glue coating nozzle for chip packaging, including a fixed press block 1, a fixed chute 2 is provided inside the fixed press block 1, and a connecting slider 3 is movably socketed on the inner wall of the fixed chute 2, and fixed The chute 2 and the connecting slider 3 are connected through the transmission of the blocking spring 4. The bottom end of the connecting slider 3 is fixedly installed with an output pipeline 5, an...
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The invention relates to the technical field of chip packaging equipment, and discloses a conductive glue coating nozzle for chip packaging, including a fixed pressing block, a fixed chute is opened inside the fixed pressing block, and the inner wall of the fixed chute The movable socket is connected with a connecting slide block, and the fixed chute and the connecting slide block are connected through a blocking spring transmission. The conductive glue coating nozzle used for chip packaging, through the setting of the fixed chute and the connecting slider, makes the coating nozzle installed on the bottom of the connecting slider be squeezed into the bonding pad under the elastic force of the recompression spring. It is in a flat position, and under the action of the coating nozzle, the nozzle can evenly smear it on the pad when coating the conductive adhesive, without making it present a raised linear structure arrangement, causing it When the chip is pressed, the distribution of the conductive adhesive is relatively uniform, and then the bonding strength and reliability of the chip are high, and the stability and performance are good.
Description
technical field [0001] The invention relates to the technical field of chip packaging equipment, in particular to a conductive glue coating nozzle for chip packaging. Background technique [0002] Conductive adhesive is a kind of adhesive with certain conductivity after curing or drying. It is mainly a mixture of metal powder and polymer with good conductivity. Function, conductive adhesive can connect a variety of conductive materials together, so that an electrical path can be formed between the connected materials. Therefore, conductive adhesive is usually used for mounting operations on integrated circuit chip packages. [0003] Among them, when using conductive adhesive to mount the chip, it will be coated on the pad of the chip with a syringe or syringe, and then the chip will be precisely pressed onto the pad coated with conductive adhesive. It is cured at a certain temperature, but when the conductive adhesive is coated with a syringe or syringe, because the nozzle ...
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IPC IPC(8): H01L21/60H01L21/603
CPCH01L24/743H01L24/75H01L2224/75152H01L2224/753
Inventor 王旭
Owner 威海和祥泰数码科技有限公司