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Method for preventing copper rolling in drilling process

A technology of copper winding and secondary drilling, applied in metal processing, electrical components, printed circuit manufacturing, etc., can solve the problems of copper winding, waste, poor uniformity of circuit boards, etc., and achieve uniform process parameters, time saving, and consistency high sex effect

Active Publication Date: 2020-11-10
广州市合成电子制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of the gong board, because the tool will pull the excess copper skin of the conductive layer during the rotation process, resulting in coiled copper, in the existing gong board process, it is necessary to manually polish the rolled board after the gong board is completed. The removal of the raised copper skin not only delays production, causes waste of personnel, but also makes it difficult to control the amount of manual polishing, resulting in poor uniformity of the produced circuit boards

Method used

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  • Method for preventing copper rolling in drilling process
  • Method for preventing copper rolling in drilling process
  • Method for preventing copper rolling in drilling process

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Embodiment Construction

[0021] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0022] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in ...

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Abstract

The invention discloses a method for preventing copper rolling in a drilling process. The method comprises the following steps of feeding, perforating, primary drilling and secondary drilling, whereina circuit board to be segmented is fixed on a carrier of a routing machine in feeding; a plurality of rows of stamp holes are perforated in a circuit board along a predetermined segmentation path inperforating; a drill bit is controlled to segment circuit board connecting parts between every two adjacent stamp holes, and semicircular holes are formed in the edges of the segmented circuit board in primary drilling; the drill bit is controlled to carry out feeding towards the area outside the circuit board, and the drill bit cuts off copper sheets rolled up on the inner walls of the semicircular holes in secondary drilling; and by means of the method for preventing copper rolling in the drilling process, uniformity of the produced circuit board can be good, and meanwhile the labor cost issaved.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a method for preventing copper curling during drilling. Background technique [0002] In the current circuit board production process, there are usually two ways to process the shape of the circuit board. One is to open several stamp holes along the predetermined path on the PCB body, and then use a machine tool to cut off the connection between the stamp holes. This method is called gong board; another method is to place the circuit board on a punch, and use the punch to drive a special mold to punch out the circuit board. This method is called beer board. [0003] In the process of the gong board, because the tool will pull the excess copper skin of the conductive layer during the rotation process, resulting in coiled copper, in the existing gong board process, it is necessary to manually polish the rolled board after the gong board is completed. The removal of the rais...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/16H05K3/00
CPCB26F1/16H05K3/0047H05K2203/0214
Inventor 宋占国曹果辉孙国朝乔金胜徐同国
Owner 广州市合成电子制品有限公司