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Chip packaging and manufacturing equipment

A technology for manufacturing equipment and chip packaging. It is used in semiconductor/solid-state device manufacturing, transportation and packaging, and conveyor objects. It can solve problems such as increased bonding energy, bond wire breakage, chip lead position deviation, etc., to avoid movement. , the effect of improving the efficiency of packaging manufacturing

Inactive Publication Date: 2020-11-13
深圳市三航工业技术研究院
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

Chips need to be wire-bonded during chip packaging. The new bonding equipment can automatically extend the bonding time and increase the bonding energy, so that the contaminated surface can be bonded by friction to form a large enough adhesive force. Lead deformation to a large extent and frequent lead breakage at the root of the bond
During the wiring process, the chip is easy to move, causing the position deviation of the chip lead

Method used

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  • Chip packaging and manufacturing equipment
  • Chip packaging and manufacturing equipment
  • Chip packaging and manufacturing equipment

Examples

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Embodiment Construction

[0028] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0029] Wherein, the accompanying drawings are only for illustrative purposes, showing only schematic diagrams, rather than physical drawings, and should not be construed as limitations on this patent; in order to better illustrate the embodiments of the present invention, some parts of the accompanying drawings will be omitted, Enlargement or reduction does not represent the size of the actual product; for those skilled in the art, it is understandable that certain known structures and their descriptions in the drawings may be omitted.

[0030] In the drawings of the embodiments of the present invention, the same or similar symbols correspond to the same or similar components; , "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional ...

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Abstract

The invention discloses chip packaging and manufacturing equipment. The equipment comprises a base, a first conveying belt and a second conveying belt. The first conveying belt and the second conveying belt are installed on the base. The first conveying belt and the second conveying belt are arranged in parallel. The first conveying belt is used for conveying an initial chip. The second conveyingbelt is used for conveying the processed chips; and a suction mechanical arm is arranged between the first conveying belt and the second conveying belt. The suction mechanical arm can suck the chip; awelding manipulator is arranged on one side of the second conveying belt; the suction mechanical arm grabs the initial chip into a limiting groove in the turntable; when the chip is placed in the limiting groove, a welding gun of the welding assembly welds the chip with a lead, a first motor drives a first fluted disc to rotate, then a second fluted disc is driven to rotate, and therefore a rotary disc is driven to rotate, the chip is rotationally welded with the lead, and the packaging and manufacturing efficiency of the chip is improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip packaging manufacturing equipment. Background technique [0002] Chip, also known as microcircuit, microchip, integrated circuit. Refers to silicon chips containing integrated circuits, which are small in size and are often part of computers or other electronic equipment. Chips need to be wire-bonded during chip packaging. The new bonding equipment can automatically extend the bonding time and increase the bonding energy, so that the contaminated surface can be bonded by friction to form a large enough adhesive force. It causes deformation of the wire to a large extent and frequently causes wire breakage at the root of the bond. During the wiring process, the chip is prone to move, resulting in deviation of the lead position of the chip. Contents of the invention [0003] In order to solve the deficiencies of the prior art, the object of the present invention i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67121H01L21/67706
Inventor 朱雪峰
Owner 深圳市三航工业技术研究院
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