Chip test assembly line and chip test method

Abstract

The invention discloses a chip testing assembly line and a chip testing method, and the assembly line sequentially comprises an automatic feeding machine, a material turnover device, an auxiliary feeding machine, a testing machine and an automatic discharging device, and all parts are connected through a transmission line. The automatic feeding machine grabs the chips; the testing machine detectsthe chip; and the automatic discharging device is used for sorting the chips. According to the chip testing assembly line and the chip testing method, the whole process is automatically tested, and the chip testing assembly line and the chip testing method are of a combined structure and can be flexibly combined, so that the whole testing line is always in the highest-efficiency state; the high-low-temperature wide-temperature-range rapid switching capability is achieved, and traditional aging equipment can be replaced for aging of a chip testing link; the advantage that a test module can be updated is fully utilized, multi-task introduction is achieved, and the remarkable characteristic of flexible manufacturing is achieved; aiming at the characteristic of frequent IC test upgrading, a test structure body modularization scheme is adopted, and continuous availability of equipment is provided for rapid product upgrading.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip testing assembly line and a chip testing method. Background technique [0002] With the transformation of the production process, more and more automation equipment has been put into the production line operation to replace manual simple and repetitive assembly line operations, thereby reducing labor costs and improving productivity and corporate competitiveness. At present, the chip automatic test assembly line has been widely used, but in other links, such as chip loading, unloading, and material transfer, manual further processing is required, which increases the workload, reduces production efficiency, and affects production capacity. Also increased production cost. [0003] The various parts of the current chip test pipeline are mostly rigidly matched, and the response to different chip test requirements is relatively weak. It cannot meet the above requirements...

AI Technical Summary

Problems solved by technology

[0004] The technical problem that the present invention mainly solves is: provide a kind of chip test assembly line and chip test method, solve the automation degree that existing chip test assembly line is not high, the production efficiency of test assembly line can not guarantee to always be efficient, can not better adapt to the replacement of test chip. Issues with changing testing requirements

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