High-frequency circuit board and manufacturing method thereof
A high-frequency circuit board and manufacturing method technology, applied in printed circuit manufacturing, multilayer circuit manufacturing, printed circuit and other directions, can solve the problems of line signal interference enhancement, increase cost, increase the number of layers, etc., to reduce signal interference, meet the The effect of high-density circuit layout
Active Publication Date: 2020-11-20
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
In the traditional circuit board design process, if high-frequency signals need to be used, the design is usually made of high-frequency materials for the entire layer, which not only increases the number of layers but also increases the cost. As the circuit layout density increases, the signal interference between lines also strengthened
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[0057] In order to make the technical content disclosed in the present invention more detailed and complete, reference may be made to the drawings and the following various specific embodiments of the present invention, and the same symbols in the drawings represent the same or similar elements. However, those skilled in the art should understand that the examples provided below are not intended to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only and are not drawn to scale according to their actual size.
[0058] Such as Figure 1-9 Shown is a manufacturing method of the sub-board 12 of the high-frequency circuit board 10 according to an embodiment of the present invention. According to different requirements, the order of steps in the manufacturing method of the sub-board 12 of the high-frequency circuit board 10 can be changed, and some steps can be omitted or combined. The manufacturing method of the sub-board 12 of th...
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The invention provides a high-frequency circuit board, which comprises: a mother board, wherein the mother board comprises a first board body and a first circuit, the first circuit is arranged on thesurface of at least one side of the first board body, and the mother board is provided with at least one accommodating cavity penetrating through the mother board; a daughter board, wherein the daughter board comprises a second board body and a second circuit, the second board body is made of a high-frequency material, the second circuit is arranged on at least one side of the second board body, at least part of the second circuit is embedded in the second board body, the daughter board further comprises a plurality of supporting columns, the supporting columns are arranged on the surface of the daughter board, and the daughter board is arranged in the accommodating cavity; and a dielectric layer, wherein a gap between the daughter board and the mother board is filled with the dielectric layer. The invention further provides a manufacturing method of the high-frequency circuit board.
Description
technical field [0001] The invention relates to a circuit board technology, in particular to a high-frequency circuit board and a manufacturing method of the high-frequency circuit board. Background technique [0002] With the gradual development and application of 4G / 5G high-frequency transmission technology and digital wireless processing technology, there are higher requirements for the dielectric constant and dielectric loss of circuit board materials used in 4G / 5G high-frequency transmission technology . In the traditional circuit board design process, if high-frequency signals need to be used, the design is usually made of high-frequency materials for the entire layer, which increases the number of layers and increases the cost. As the circuit layout density increases, the signal interference between lines also strengthened. How to solve the above problems needs to be considered by those skilled in the art. Contents of the invention [0003] In view of this, the p...
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IPC IPC(8): H05K1/02H05K1/14H05K3/36H05K3/46
CPCH05K1/0218H05K1/142H05K3/36H05K3/4697H05K2201/0195H05K3/4602H05K1/185H05K1/141H05K1/024H05K1/032H05K1/144H05K2201/09509H05K3/4038H05K1/115
Inventor 杨永泉魏永超
Owner AVARY HLDG (SHENZHEN) CO LTD