High-frequency circuit board and manufacturing method thereof
A high-frequency circuit board and manufacturing method technology, applied in printed circuit manufacturing, multilayer circuit manufacturing, printed circuit and other directions, can solve the problems of increased cost, enhanced line signal interference, increased number of layers, etc., to meet the requirements of high-density circuit layout , reduce the effect of signal interference
Active Publication Date: 2022-01-11
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
In the traditional circuit board design process, if high-frequency signals need to be used, the design is usually made of high-frequency materials for the entire layer, which not only increases the number of layers but also increases the cost. As the circuit layout density increases, the signal interference between lines also strengthened
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[0057] In order to make the technical content disclosed in the present invention more detailed and complete, reference may be made to the drawings and the following various specific embodiments of the present invention, and the same symbols in the drawings represent the same or similar elements. However, those skilled in the art should understand that the examples provided below are not intended to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only and are not drawn to scale according to their actual size.
[0058] Such as Figure 1-9 Shown is a manufacturing method of the sub-board 12 of the high-frequency circuit board 10 according to an embodiment of the present invention. According to different requirements, the order of steps in the manufacturing method of the sub-board 12 of the high-frequency circuit board 10 can be changed, and some steps can be omitted or combined. The manufacturing method of the sub-board 12 of th...
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A high-frequency circuit board, comprising: a motherboard, the motherboard includes a first board body and a first circuit, the first circuit is arranged on at least one side surface of the first board body, the motherboard There is at least one accommodating cavity through the motherboard; a sub-board, the sub-board includes a second board body and a second line, the second board body is a high-frequency material, and the second line is set On at least one side of the second board body, at least part of the second circuit is embedded in the second board body, and the sub-board further includes a plurality of pillars, and the pillars are arranged on the surface of the sub-board , the sub-board is disposed in the accommodating cavity, a dielectric layer, and the dielectric layer fills the gap between the sub-board and the motherboard. The invention also provides a manufacturing method of the high-frequency circuit board.
Description
technical field [0001] The invention relates to a circuit board technology, in particular to a high-frequency circuit board and a manufacturing method of the high-frequency circuit board. Background technique [0002] With the gradual development and application of 4G / 5G high-frequency transmission technology and digital wireless processing technology, there are higher requirements for the dielectric constant and dielectric loss of circuit board materials used in 4G / 5G high-frequency transmission technology . In the traditional circuit board design process, if high-frequency signals need to be used, the design is usually made of high-frequency materials for the entire layer, which increases the number of layers and increases the cost. As the circuit layout density increases, the signal interference between lines also strengthened. How to solve the above problems needs to be considered by those skilled in the art. Contents of the invention [0003] In view of this, the p...
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IPC IPC(8): H05K1/02H05K1/14H05K3/36H05K3/46
CPCH05K1/0218H05K1/142H05K3/36H05K3/4697H05K2201/0195H05K3/4602H05K1/185H05K1/141H05K1/024H05K1/032H05K1/144H05K2201/09509H05K3/4038H05K1/115
Inventor 杨永泉魏永超
Owner AVARY HLDG (SHENZHEN) CO LTD