Comparison spectrum system and measurement method for realizing high depth-to-width ratio micro-groove depth measurement

A technology of depth measurement and high aspect ratio, which is applied in the field of comparative spectral measurement system of high aspect ratio micro-groove depth, can solve the problem of limited Fourier analysis frequency resolution, large error of depth value, and influence of spectral analysis method on depth measurement range and other issues to achieve the effect of improving the calculation efficiency and accuracy of the solution and facilitating matching

Inactive Publication Date: 2020-11-24
TIANJIN UNIV
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is limited by the frequency resolution of Fourier analysis, resulting in a large error in the depth value obtained by analysis.
At the same time, the chromatic aberration of the sample and the optical system also affects the depth measurement range of the spectroscopic analysis method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Comparison spectrum system and measurement method for realizing high depth-to-width ratio micro-groove depth measurement
  • Comparison spectrum system and measurement method for realizing high depth-to-width ratio micro-groove depth measurement
  • Comparison spectrum system and measurement method for realizing high depth-to-width ratio micro-groove depth measurement

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0028] like figure 1 As shown in FIG. 1 , it is a structural schematic diagram of a comparison spectroscopy system for realizing the depth measurement of micro-grooves with high aspect ratio according to the present invention. The system includes a light source module 100 , a beam splitter 200 , a sample measurement module 300 , a reference object measurement module 400 and a spectrum collection module 500 . Wherein, the light source module 100 outputs an illumination beam with a set diameter; the illumination beam is divided into two beams of light by the beam splitter 200, and enters the sample measurement module 300 and the reference object measurement module 400 respectively; the sample measurement module 300 and the reference object measurement module 400 respectively The sample spectrum and the reference spectrum ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a comparison spectrum system and a measurement method for realizing high depth-to-width ratio micro-groove depth measurement. The comparison spectrum system comprises a light source module (100), a beam splitter (200), a sample measurement module (300), a reference substance measurement module (400) and a spectrum acquisition module (500), wherein the light source module (100) outputs an illumination light beam with a set diameter, and the beam splitter (200) splits the illumination light beam into two light beams which respectively enter the sample measurement module (300) and the reference substance measurement module (400); the sample measurement module (300) and the reference substance measurement module (400) return a sample spectrum and a reference substance spectrum respectively; and the spectrum acquisition module is used for collecting spectrums of the sample and the reference substance, transmitting the spectrums to the computer for calculating a comparison spectrum, and analyzing the depth value of the groove with the high depth-to-width ratio by utilizing a spectral Fourier analysis method and a spectral fitting method. According to the invention, the influence of sample chromatic aberration on the depth measurement range and the analysis accuracy is avoided; and the understanding calculation efficiency and precision are improved.

Description

technical field [0001] The invention relates to the technical field of non-destructive measurement of depth values ​​of high aspect ratio microstructures, in particular to a system and method for contrast spectrum measurement of the depth of microgrooves with high aspect ratio. Background technique [0002] With the continuous improvement of MEMS process technology and application level, the high aspect ratio micro-trench structure can significantly improve the charge storage capacity and increase the interdigital capacitance and sensor sensitivity due to its narrow and vertical air gap and large specific surface area. , Therefore, it has a wide range of applications in the fields of comb-shaped microelectrode arrays, supercapacitors, acceleration sensors, gyroscopes, gratings, and micro-nano resonators. In order to improve the quality of MEMS trench manufacturing and ensure device yield, it is necessary to measure and analyze its three-dimensional characteristic dimensions ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/22
CPCG01B11/22
Inventor 胡春光武飞宇霍树春曲正王浩沈万福胡晓东胡小唐刘晶
Owner TIANJIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products