Wafer clamping device for semiconductor packaging

Abstract

The invention discloses a wafer clamping device for semiconductor packaging. The clamping device structurally comprises a mounting plate, a sliding rail, a driving rod and a clamping mechanism. A slide rail is welded at the bottom of the mounting plate. The driving rod penetrates through the interior of the sliding rail in a clearance fit manner. The metal pins are attached and fixed through the magnetic adsorption force of the magnetic plate. Therefore, the clamping force is prevented from being too large. Excessive extrusion force on the metal pin is avoided. The sliding rod drives the supporting rod and the scraping plate to stably slide in a clamping gap groove in the fixed seat. Foreign matters in the gap groove are scraped. The metal pins of the semiconductor integrated circuit are just clamped and limited with the outer side surfaces of the clamping sheets. Meanwhile, the bottom surface of the semiconductor integrated circuit extrudes the extrusion plate downwards, so that the extrusion plate extrudes the interior of the air pressure chamber, the air pressure in the air bag film is increased to bulge, the bulged air bag film pushes against the metal pin to buffer the metal pin, and the metal pin is prevented from being broken due to overlarge clamping force.

Description

technical field [0001] The invention relates to the field of semiconductors, and more specifically, to a clipper for semiconductor packaging. Background technique [0002] Dual-in-line packaging is one of the packaging methods of semiconductor integrated circuits. The shape of the integrated circuit is rectangular, and there are two rows of parallel metal pins on both sides. The integrated circuit clamps the metal pins to ensure normal packaging work, but because the clipper clamps the metal pins in the process, in order to improve the firmness of the clamping, the clamping force is too strong, thus The extrusion force between the metal pin and the clip is too large, and the metal pin is relatively small, causing the metal pin to break easily inside the clip, and it is difficult to take it out from the gap of the clip, resulting in damage to the semiconductor integrated circuit , and cause the clipper to not firmly clamp the metal pin of the next semiconductor integrated ci...

AI Technical Summary

Problems solved by technology

[0002] Dual-in-line packaging is one of the packaging methods of semiconductor integrated circuits. The shape of the integrated circuit is rectangular, and there are two rows of parallel metal pins on both sides. The integrated circuit clamps the metal pins to ensure normal packaging work, but because the clipper clamps the metal pins in the process, in order to improve the firmness of the clamping, the clamping force is too strong, thus The extrusion force between the metal pin and the clip is too large, and the metal pin is relatively small, causing the metal pin to break easily inside the clip, and it is difficult to take it out from the gap of the clip, resulting in damage to the semiconductor integrated circuit , and cause the clamper to not firmly clamp the metal pin of the next semiconductor integrated circuit

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