Method for detecting working stress based on blind hole method
A technology of working stress and blind hole method, which is applied in the direction of measuring force components, measuring devices, testing of mechanical parts, etc., can solve the problems of low measurement accuracy, achieve the effect of improving detection accuracy and reducing costs
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[0059] The following is attached Figure 1-3 The application is described in further detail.
[0060] The embodiment of the present application discloses a method for detecting working stress based on the blind hole method, which includes the following steps:
[0061] S1: establish the mathematical relationship between the strain release coefficient and the release strain, and calculate the theoretical value of the strain release coefficient by the finite element method;
[0062] S2: Drill a blind hole on the surface of the component under test and measure the first release strain;
[0063] S3: Carry out plastic strain correction at the edge of the hole to the strain relief coefficient, and obtain the first release correction strain relief coefficient;
[0064] S4: Carrying out drilling processing strain correction to the strain relief coefficient to obtain a second revised strain relief coefficient;
[0065] S5: Calculate the working stress according to the stress conditio...
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